A Micromechanics-Based Vapor Pressure Model in Electronic Packages

XJ Fan, J Zhou, GQ Zhang, LJ Ernst

Research output: Contribution to journalArticleScientificpeer-review

56 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)262-267
Number of pages6
JournalJournal of Electronic Packaging
Publication statusPublished - 2005

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