A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas

G de Graaf; HW Wu; RF Wolffenbuttel

doi:10.1109/ESIME.2011.5765809

A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas

Electronic Instrumentation

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Editors	O De Saint Leger, More Editors
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	1-5
ISBN (Print)	978-1-4577-0107-8
DOIs	https://doi.org/10.1109/ESIME.2011.5765809
Publication status	Published - 2011
Event	EuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria Duration: 18 Apr 2011 → 20 Apr 2011 Conference number: 12

Conference

Conference	EuroSimE 2011
Country/Territory	Austria
City	Linz
Period	18/04/11 → 20/04/11

Access to Document

10.1109/ESIME.2011.5765809

Cite this

de Graaf, G., Wu, HW., & Wolffenbuttel, RF. (2011). A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas. In O. De Saint Leger, & M. Editors (Eds.), Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (pp. 1-5). IEEE. https://doi.org/10.1109/ESIME.2011.5765809

de Graaf, G ; Wu, HW ; Wolffenbuttel, RF. / A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas. Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. editor / O De Saint Leger ; More Editors. Piscataway, NJ : IEEE, 2011. pp. 1-5

@inproceedings{ad8895d333194f0e88138b7c0d0f8a45,

title = "A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas",

author = "{de Graaf}, G and HW Wu and RF Wolffenbuttel",

year = "2011",

doi = "10.1109/ESIME.2011.5765809",

language = "English",

isbn = "978-1-4577-0107-8",

pages = "1--5",

editor = "{De Saint Leger}, O and More Editors",

booktitle = "Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

publisher = "IEEE",

address = "United States",

note = "EuroSimE 2011 : 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 18-04-2011 Through 20-04-2011",

}

de Graaf, G, Wu, HW & Wolffenbuttel, RF 2011, A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas. in O De Saint Leger & M Editors (eds), Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. IEEE, Piscataway, NJ, pp. 1-5, EuroSimE 2011, Linz, Austria, 18/04/11. https://doi.org/10.1109/ESIME.2011.5765809

A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas. / de Graaf, G; Wu, HW; Wolffenbuttel, RF.
Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. ed. / O De Saint Leger; More Editors. Piscataway, NJ: IEEE, 2011. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas

AU - de Graaf, G

AU - Wu, HW

AU - Wolffenbuttel, RF

N1 - Conference code: 12

PY - 2011

Y1 - 2011

U2 - 10.1109/ESIME.2011.5765809

DO - 10.1109/ESIME.2011.5765809

M3 - Conference contribution

SN - 978-1-4577-0107-8

SP - 1

EP - 5

BT - Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

A2 - De Saint Leger, O

A2 - Editors, More

PB - IEEE

CY - Piscataway, NJ

T2 - EuroSimE 2011

Y2 - 18 April 2011 through 20 April 2011

ER -

de Graaf G, Wu HW, Wolffenbuttel RF. A model for static and dynamic thermal analysis of thin film MEMS structures including the thermal conductivity of the surrounding gas. In De Saint Leger O, Editors M, editors, Proceedings 2011 12th International Conference on Thermal, Mechnical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ: IEEE. 2011. p. 1-5 doi: 10.1109/ESIME.2011.5765809