Skip to main navigation Skip to search Skip to main content

A Multi-Agent Digital Twin Framework for Health Monitoring of SiC MOSFETs in Power Converters

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

Modeling and monitoring advanced power semi-conductor packages are challenging due to their multiphysics behavior, structural complexity, and the high computational cost associated with detailed models. Conventional high-fidelity approaches, such as finite element models, provide high accuracy but are often unsuitable for applications like health monitoring, while purely data-driven models may lack physical interpretability and robustness under degradation.This paper proposes the concept of a multi-agent digital twin framework to address these challenges by decomposing the overall system into interconnected virtual domains with different roles and fidelity levels. The approach is demonstrated for health monitoring of a SiC MOSFET in a DC-DC buck converter. A three-agent architecture is implemented, consisting of a temporal ANN for system identification, a decision layer for failure detection and localization, and a parametric reduced-order thermal model for failure assessment. Experimental results show that the proposed framework can accurately identify system behavior, detect and localize failures, and quantify parameter variations associated with degradation.

Original languageEnglish
Title of host publicationProceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026
PublisherIEEE
Number of pages8
ISBN (Electronic)9798331562496
DOIs
Publication statusPublished - 2026
Event27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026 - Warsaw, Poland
Duration: 19 Apr 2026 → 22 Apr 2026

Publication series

NameProceedings - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026

Conference

Conference27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2026
Country/TerritoryPoland
CityWarsaw
Period19/04/26 → 22/04/26

Keywords

  • AI
  • Buck Converter
  • Digital Twin
  • Power Semiconductors
  • SiC MOSFET

Fingerprint

Dive into the research topics of 'A Multi-Agent Digital Twin Framework for Health Monitoring of SiC MOSFETs in Power Converters'. Together they form a unique fingerprint.

Cite this