A new self-sealing thin-film encapsulation process for MEMS

F Santagata, I Zaccaria, RH Poelma, JF Creemer, GQ Zhang, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationProceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII
EditorsJR Morante, C Hierold
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages822-825
Number of pages4
ISBN (Print)978-1-4673-5983-2
DOIs
Publication statusPublished - 2013
EventTransducers 2013 & Eurosensors XXVII, Barcelona, Spain - Piscataway, NJ, USA
Duration: 16 Jun 201320 Jun 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceTransducers 2013 & Eurosensors XXVII, Barcelona, Spain
Period16/06/1320/06/13

Cite this

Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ., & Sarro, PM. (2013). A new self-sealing thin-film encapsulation process for MEMS. In JR. Morante, & C. Hierold (Eds.), Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII (pp. 822-825). IEEE Society. https://doi.org/10.1109/Transducers.2013.6626893