A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

J Su, HW van Zeijl, SL Paalvast, PM Sarro, J van Eijk

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

46 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors
Editors s.n.
Place of PublicationVeldhoven
Publishers.l.
Pages394-397
Number of pages4
ISBN (Print)90-73461-44-8
Publication statusPublished - 2006
Event9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands - Utrecht
Duration: 23 Nov 200624 Nov 2006

Publication series

Name
Publishers.l.

Conference

Conference9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands
Period23/11/0624/11/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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