A novel method for nanoprecision alignment in wafer bonding applications

LD Jiang, G Pandraud, PJ French, S.M. Spearing, M. kraft

Research output: Contribution to journalArticleScientificpeer-review

22 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)S61-S67
JournalJournal of Micromechanics and Microengineering
Volume17
Issue number7
Publication statusPublished - 2007

Keywords

  • Elektrotechniek
  • Techniek
  • academic journal papers
  • CWTS 0.75 <= JFIS < 2.00

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