A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays

AM Savov, AH Noor, R Dekker

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT
Editors	SF Wang
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	145-148
Number of pages	4
ISBN (Print)	978-1-4673-9690-5
DOIs	https://doi.org/10.1109/IMPACT.2015.7365191
Publication status	Published - 2015
Event	IMPACT 2015, Taipei, Taiwan - Piscataway Duration: 21 Oct 2015 → 23 Oct 2015

Name
Publisher	IEEE

Conference	IMPACT 2015, Taipei, Taiwan
Period	21/10/15 → 23/10/15

Access to Document

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title = "A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays",

author = "AM Savov and AH Noor and R Dekker",

year = "2015",

doi = "10.1109/IMPACT.2015.7365191",

language = "English",

isbn = "978-1-4673-9690-5",

publisher = "IEEE Society",

pages = "145--148",

editor = "SF Wang",

booktitle = "Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT",

note = "IMPACT 2015, Taipei, Taiwan ; Conference date: 21-10-2015 Through 23-10-2015",

}

Savov, AM, Noor, AH & Dekker, R 2015, A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays. in SF Wang (ed.), Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. IEEE Society, Piscataway, pp. 145-148, IMPACT 2015, Taipei, Taiwan, 21/10/15. https://doi.org/10.1109/IMPACT.2015.7365191

A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays. / Savov, AM; Noor, AH; Dekker, R.
Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. ed. / SF Wang. Piscataway: IEEE Society, 2015. p. 145-148.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A novel processing concept for reduction of substrate artifacts in ultrasound transducer arrays

AU - Savov, AM

AU - Noor, AH

AU - Dekker, R

PY - 2015

Y1 - 2015

U2 - 10.1109/IMPACT.2015.7365191

DO - 10.1109/IMPACT.2015.7365191

M3 - Conference contribution

SN - 978-1-4673-9690-5

SP - 145

EP - 148

BT - Proceedings of the 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

A2 - Wang, SF

PB - IEEE Society

CY - Piscataway

T2 - IMPACT 2015, Taipei, Taiwan

Y2 - 21 October 2015 through 23 October 2015

ER -