In this paper, we will present a novel MEMS Pirani sensor with triple heat sinks. The sensors are made on SOI (Silicon On Insulator) wafers leading to a very simple process and good mechanical structures as compared to alternative surface micromachining processes. Moreover, the proposed Pirani has three heat sinks. The area of heat loss through the ambient gas is greatly enlarged as compared to Pirani sensors with one or dual heat sinks without increasing the dimension of the sensor. Consequently, the dynamic pressure range of the Pirani sensor will be enlarged.
Keywords: Pirani; SOI; Triple; Heat sink; Pressure; Sensor
|Title of host publication||Proceedings of the Eurosensors XXIII conference, 6-9 September 2009, Lausanne, Switzerland|
|Editors|| Brugger, J., Briand, D.|
|Number of pages||4|
|Publication status||Published - 2009|
- conference contrib. refereed
- Conf.proc. > 3 pag