A novel SOI Pirani sensor with triple heat sinks

Q Li; JFL Goosen; JMT Beek; F van Keulen

A novel SOI Pirani sensor with triple heat sinks

Q Li, JFL Goosen, JMT Beek, F van Keulen

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

4 Citations (Scopus)

Abstract

In this paper, we will present a novel MEMS Pirani sensor with triple heat sinks. The sensors are made on SOI (Silicon On Insulator) wafers leading to a very simple process and good mechanical structures as compared to alternative surface micromachining processes. Moreover, the proposed Pirani has three heat sinks. The area of heat loss through the ambient gas is greatly enlarged as compared to Pirani sensors with one or dual heat sinks without increasing the dimension of the sensor. Consequently, the dynamic pressure range of the Pirani sensor will be enlarged. Keywords: Pirani; SOI; Triple; Heat sink; Pressure; Sensor

Original language	Undefined/Unknown
Title of host publication	Proceedings of the Eurosensors XXIII conference, 6-9 September 2009, Lausanne, Switzerland
Editors	Brugger, J., Briand, D.
Publisher	Elsevier
Pages	160-163
Number of pages	4
ISBN (Print)	1876-6196
Publication status	Published - 2009

Publication series

Name
Publisher	Elsevier

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{0e7c6250396b4a5c868170d9dd24f68f,

title = "A novel SOI Pirani sensor with triple heat sinks",

abstract = "In this paper, we will present a novel MEMS Pirani sensor with triple heat sinks. The sensors are made on SOI (Silicon On Insulator) wafers leading to a very simple process and good mechanical structures as compared to alternative surface micromachining processes. Moreover, the proposed Pirani has three heat sinks. The area of heat loss through the ambient gas is greatly enlarged as compared to Pirani sensors with one or dual heat sinks without increasing the dimension of the sensor. Consequently, the dynamic pressure range of the Pirani sensor will be enlarged. Keywords: Pirani; SOI; Triple; Heat sink; Pressure; Sensor",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "Q Li and JFL Goosen and JMT Beek and {van Keulen}, F",

year = "2009",

language = "Undefined/Unknown",

isbn = "1876-6196",

publisher = "Elsevier",

pages = "160--163",

editor = "{Brugger, J.} and {Briand, D.}",

booktitle = "Proceedings of the Eurosensors XXIII conference, 6-9 September 2009, Lausanne, Switzerland",

}

TY - GEN

T1 - A novel SOI Pirani sensor with triple heat sinks

AU - Li, Q

AU - Goosen, JFL

AU - Beek, JMT

AU - van Keulen, F

PY - 2009

Y1 - 2009

N2 - In this paper, we will present a novel MEMS Pirani sensor with triple heat sinks. The sensors are made on SOI (Silicon On Insulator) wafers leading to a very simple process and good mechanical structures as compared to alternative surface micromachining processes. Moreover, the proposed Pirani has three heat sinks. The area of heat loss through the ambient gas is greatly enlarged as compared to Pirani sensors with one or dual heat sinks without increasing the dimension of the sensor. Consequently, the dynamic pressure range of the Pirani sensor will be enlarged. Keywords: Pirani; SOI; Triple; Heat sink; Pressure; Sensor

AB - In this paper, we will present a novel MEMS Pirani sensor with triple heat sinks. The sensors are made on SOI (Silicon On Insulator) wafers leading to a very simple process and good mechanical structures as compared to alternative surface micromachining processes. Moreover, the proposed Pirani has three heat sinks. The area of heat loss through the ambient gas is greatly enlarged as compared to Pirani sensors with one or dual heat sinks without increasing the dimension of the sensor. Consequently, the dynamic pressure range of the Pirani sensor will be enlarged. Keywords: Pirani; SOI; Triple; Heat sink; Pressure; Sensor

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1876-6196

SP - 160

EP - 163

BT - Proceedings of the Eurosensors XXIII conference, 6-9 September 2009, Lausanne, Switzerland

A2 - Brugger, J., null

A2 - Briand, D., null

PB - Elsevier

ER -