A novel SOI Pirani sensor with triple heat sinks

Q Li, JFL Goosen, JMT Beek, F van Keulen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

4 Citations (Scopus)


In this paper, we will present a novel MEMS Pirani sensor with triple heat sinks. The sensors are made on SOI (Silicon On Insulator) wafers leading to a very simple process and good mechanical structures as compared to alternative surface micromachining processes. Moreover, the proposed Pirani has three heat sinks. The area of heat loss through the ambient gas is greatly enlarged as compared to Pirani sensors with one or dual heat sinks without increasing the dimension of the sensor. Consequently, the dynamic pressure range of the Pirani sensor will be enlarged. Keywords: Pirani; SOI; Triple; Heat sink; Pressure; Sensor
Original languageUndefined/Unknown
Title of host publicationProceedings of the Eurosensors XXIII conference, 6-9 September 2009, Lausanne, Switzerland
Editors Brugger, J., Briand, D.
Number of pages4
ISBN (Print)1876-6196
Publication statusPublished - 2009

Publication series



  • conference contrib. refereed
  • Conf.proc. > 3 pag

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