A PCB system integration concept for power electronics

I Josifovic, J Popovi¿-Gerber, JA Ferreira

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Abstract

    Abstract Current passive components construction technologies and power converters manufacturing methods are the main barriers limiting the power density improvement. In this paper a new PCB system integration concept for power converters construction - power sandwich, that allows for a high density packaging, effective thermal management and automated manufacturing is introduced. In the Power sandwich integration concept new passive components, x-dimension components, having the same height (x) and double sided electrical terminations are stacked between planar substrates and soldered on two sides. Depending on the number of stack layers (x-layers) and the components loss density, various arrangements in the power sandwich converter is possible. A power sandwich demonstrator, 70 W flyback converter, is designed and implemented using modified standard components representing the prototype of x-dimension components. The spatial and thermal designs are discussed in detail and the experimental results of the first power sandwich demonstrator are shown.
    Original languageUndefined/Unknown
    Title of host publicationProceedings IEEE 6th International Power Electronics and Motion Control Conference, 2009. IPEMC '09
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages756-762
    Number of pages7
    ISBN (Print)978-1-4244-3556-2
    DOIs
    Publication statusPublished - 2009
    EventPower Electronics and Motion Control Conference, 2009. IPEMC '09. IEEE 6th International, Wuhan, China - Piscataway
    Duration: 17 May 200920 May 2009

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferencePower Electronics and Motion Control Conference, 2009. IPEMC '09. IEEE 6th International, Wuhan, China
    Period17/05/0920/05/09

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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