Current passive components construction technologies and power converters manufacturing methods are the main barriers limiting the power density improvement. In this paper a new PCB system integration concept for power converters construction - power sandwich, that allows for a high density packaging, effective thermal management and automated manufacturing is introduced. In the Power sandwich integration concept new passive components, x-dimension components, having the same height (x) and double sided electrical terminations are stacked between planar substrates and soldered on two sides. Depending on the number of stack layers (x-layers) and the components loss density, various arrangements in the power sandwich converter is possible. A power sandwich demonstrator, 70 W flyback converter, is designed and implemented using modified standard components representing the prototype of x-dimension components. The spatial and thermal designs are discussed in detail and the experimental results of the first power sandwich demonstrator are shown.
|Conference||Power Electronics and Motion Control Conference, 2009. IPEMC '09. IEEE 6th International, Wuhan, China|
|Period||17/05/09 → 20/05/09|
- conference contrib. refereed
- Conf.proc. > 3 pag