@inproceedings{dbb6e0c401e34f6c9eae443ca1840b4e,
title = "A PCB system integration concept for power electronics",
abstract = "Abstract Current passive components construction technologies and power converters manufacturing methods are the main barriers limiting the power density improvement. In this paper a new PCB system integration concept for power converters construction - power sandwich, that allows for a high density packaging, effective thermal management and automated manufacturing is introduced. In the Power sandwich integration concept new passive components, x-dimension components, having the same height (x) and double sided electrical terminations are stacked between planar substrates and soldered on two sides. Depending on the number of stack layers (x-layers) and the components loss density, various arrangements in the power sandwich converter is possible. A power sandwich demonstrator, 70 W flyback converter, is designed and implemented using modified standard components representing the prototype of x-dimension components. The spatial and thermal designs are discussed in detail and the experimental results of the first power sandwich demonstrator are shown.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "I Josifovic and J Popovi¿-Gerber and JA Ferreira",
year = "2009",
doi = "doi:PEMC.2009.5157486",
language = "Undefined/Unknown",
isbn = "978-1-4244-3556-2",
publisher = "IEEE",
pages = "756--762",
editor = "s.n.",
booktitle = "Proceedings IEEE 6th International Power Electronics and Motion Control Conference, 2009. IPEMC '09",
address = "United States",
note = "Power Electronics and Motion Control Conference, 2009. IPEMC '09. IEEE 6th International, Wuhan, China ; Conference date: 17-05-2009 Through 20-05-2009",
}