A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
12 Downloads (Pure)

Abstract

This work studies the effect of randomness of LED's lumen depreciation on reliability of the entire LED lamp. An integrated LED light bulb is selected as carrier of the proposed method. A PoF based lumen depreciation model and electronic-thermal simulations are introduced for reliability prediction. The normal distribution is used to describe the statistical distribution of LEDs. The probabilities of the driver's catastrophic failures and lumen can then be obtained by Monte Carlo simulations by considering the increase of lamp's temperature. The effect of the lumen depreciation to the entire lamp is studied with two scenarios: constant light mode and constant current mode.

Original languageEnglish
Title of host publication2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages1-5
Number of pages5
ISBN (Electronic)978-1-5386-2359-6
DOIs
Publication statusPublished - 2018
EventEuroSimE 2018: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Toulouse, France
Duration: 15 Apr 201818 Apr 2018

Conference

ConferenceEuroSimE 2018
Abbreviated titleEuroSimE 2018
CountryFrance
CityToulouse
Period15/04/1818/04/18

Keywords

  • Reliability
  • Junctions
  • LED lamps
  • Light sources
  • Temperature distribution
  • Integrated circuit modeling

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  • Cite this

    Sun, B., Fan, J., Fan, X., & Zhang, G. (2018). A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps. In 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018 (pp. 1-5). IEEE. https://doi.org/10.1109/EuroSimE.2018.8369897