A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review


Real-time 3D ultrasonic imaging requires a matrix of transducer elements with a number of elements that readily exceeds the number of channels of a conventional imaging system. This paper presents an ASIC, realized in a
high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.
Original languageEnglish
Title of host publication43rd IEEE European Solid-State Circuits Conference (ESSCIRC 2017)
Place of PublicationPiscataway, NJ
Number of pages4
ISBN (Electronic)978-1-5090-5025-3
Publication statusPublished - 2017
EventESSDERC-ESSCIRC 2017: 47th European Solid-State Device Research Conference - 43rd European Solid-State Circuits Conference - Leuven, Belgium
Duration: 11 Sept 201714 Sept 2017


ConferenceESSDERC-ESSCIRC 2017
Internet address


  • medical ultrasound
  • 3D ultrasonic imaging
  • matrix transducer
  • reconfigurability


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