A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes

E. Kang; Q. Ding; M. Shabanimotlagh; P. Kruizinga; Z.Y. Chang; E. Noothout; H.J. Vos; J.G. Bosch; M.D. Verweij; N. de Jong; M.A.P. Pertijs

doi:10.1109/esscirc.2017.8094563

A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes

E. Kang, Q. Ding, M. Shabanimotlagh, P. Kruizinga, Z.Y. Chang, E. Noothout, H.J. Vos, J.G. Bosch, M.D. Verweij, N. de Jong, M.A.P. Pertijs

Electronic Instrumentation

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

Real-time 3D ultrasonic imaging requires a matrix of transducer elements with a number of elements that readily exceeds the number of channels of a conventional imaging system. This paper presents an ASIC, realized in a
high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.

Original language	English
Title of host publication	43rd IEEE European Solid-State Circuits Conference (ESSCIRC 2017)
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	211-214
Number of pages	4
ISBN (Electronic)	978-1-5090-5025-3
DOIs	https://doi.org/10.1109/esscirc.2017.8094563
Publication status	Published - 2017
Event	ESSDERC-ESSCIRC 2017: 47th European Solid-State Device Research Conference - 43rd European Solid-State Circuits Conference - Leuven, Belgium Duration: 11 Sept 2017 → 14 Sept 2017 https://www.esscirc-essderc2017.org/

Conference

Conference	ESSDERC-ESSCIRC 2017
Country/Territory	Belgium
City	Leuven
Period	11/09/17 → 14/09/17
Internet address	https://www.esscirc-essderc2017.org/

Keywords

medical ultrasound
3D ultrasonic imaging
matrix transducer
reconfigurability

Access to Document

10.1109/esscirc.2017.8094563

Cite this

Kang, E., Ding, Q., Shabanimotlagh, M., Kruizinga, P., Chang, Z. Y., Noothout, E., Vos, H. J., Bosch, J. G., Verweij, M. D., Jong, N. D., & Pertijs, M. A. P. (2017). A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes. In 43rd IEEE European Solid-State Circuits Conference (ESSCIRC 2017) (pp. 211-214). IEEE. https://doi.org/10.1109/esscirc.2017.8094563

@inproceedings{d3ee6116d476461ab7e2b478260b8a17,

title = "A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes",

abstract = "Real-time 3D ultrasonic imaging requires a matrix of transducer elements with a number of elements that readily exceeds the number of channels of a conventional imaging system. This paper presents an ASIC, realized in a high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.",

keywords = "medical ultrasound, 3D ultrasonic imaging, matrix transducer, reconfigurability",

author = "E. Kang and Q. Ding and M. Shabanimotlagh and P. Kruizinga and Z.Y. Chang and E. Noothout and H.J. Vos and J.G. Bosch and M.D. Verweij and Jong, {N. de} and M.A.P. Pertijs",

year = "2017",

doi = "10.1109/esscirc.2017.8094563",

language = "English",

pages = "211--214",

booktitle = "43rd IEEE European Solid-State Circuits Conference (ESSCIRC 2017)",

publisher = "IEEE",

address = "United States",

note = "ESSDERC-ESSCIRC 2017 : 47th European Solid-State Device Research Conference - 43rd European Solid-State Circuits Conference ; Conference date: 11-09-2017 Through 14-09-2017",

url = "https://www.esscirc-essderc2017.org/",

}

Kang, E, Ding, Q, Shabanimotlagh, M, Kruizinga, P , Chang, ZY , Noothout, E , Vos, HJ , Bosch, JG , Verweij, MD , Jong, ND & Pertijs, MAP 2017, A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes. in 43rd IEEE European Solid-State Circuits Conference (ESSCIRC 2017). IEEE, Piscataway, NJ, pp. 211-214, ESSDERC-ESSCIRC 2017, Leuven, Belgium, 11/09/17. https://doi.org/10.1109/esscirc.2017.8094563

A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes. / Kang, E.; Ding, Q.; Shabanimotlagh, M. et al.
43rd IEEE European Solid-State Circuits Conference (ESSCIRC 2017). Piscataway, NJ: IEEE, 2017. p. 211-214.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

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AU - Kang, E.

AU - Ding, Q.

AU - Shabanimotlagh, M.

AU - Kruizinga, P.

AU - Chang, Z.Y.

AU - Noothout, E.

AU - Vos, H.J.

AU - Bosch, J.G.

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AU - Jong, N. de

AU - Pertijs, M.A.P.

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N2 - Real-time 3D ultrasonic imaging requires a matrix of transducer elements with a number of elements that readily exceeds the number of channels of a conventional imaging system. This paper presents an ASIC, realized in a high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.

AB - Real-time 3D ultrasonic imaging requires a matrix of transducer elements with a number of elements that readily exceeds the number of channels of a conventional imaging system. This paper presents an ASIC, realized in a high-voltage 0.18 μm BCDMOS process, that interfaces a piezo-electric transducer array of 24 × 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels by means of a reconfigurable switch matrix and row-level low-noise amplifiers. Each element is associated with a compact bootstrapped high-voltage transmit/receive switch and programmable logic that enables a variety of imaging modes to be realized. The ASIC has been successfully used in a 3D imaging experiment.

KW - medical ultrasound

KW - 3D ultrasonic imaging

KW - matrix transducer

KW - reconfigurability

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M3 - Conference contribution

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BT - 43rd IEEE European Solid-State Circuits Conference (ESSCIRC 2017)

PB - IEEE

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Y2 - 11 September 2017 through 14 September 2017

ER -

A Reconfigurable 24 × 40 Element Transceiver ASIC for Compact 3D Medical Ultrasound Probes

Abstract

Conference

Keywords

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