TY - JOUR
T1 - A Reconfigurable Ultrasound Transceiver ASIC With 24 x 40 Elements for 3-D Carotid Artery Imaging
AU - Kang, Eunchul
AU - Ding, Qing
AU - Shabanimotlagh, Maysam
AU - Kruizinga, Pieter
AU - Chang, Zu Yao
AU - Noothout, Emile
AU - Vos, Hendrik J.
AU - Bosch, Johan G.
AU - Verweij, Martin D.
AU - de Jong, Nico
AU - Pertijs, Michiel A.P.
N1 - Accepted author manuscript
PY - 2018
Y1 - 2018
N2 - This paper presents an ultrasound transceiver application-specific integrated circuit (ASIC) designed for 3-D ultrasonic imaging of the carotid artery. This application calls for an array of thousands of ultrasonic transducer elements, far exceeding the number of channels of conventional imaging systems. The 3.6 x 6.8 mm² ASIC interfaces a piezo-electric transducer (PZT) array of 24 x 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels. Multiple ASICs can be tiled together to form an even bigger array. The ASIC, implemented in a 0.18 μm high-voltage (HV) BCD process, consists of a reconfigurable switch matrix and row-level receive circuits. Each element is associated with a compact bootstrapped HV transmit switch, an isolation switch for the receive circuits and programmable logic that enables a variety of imaging modes. Electrical and acoustic experiments successfully demonstrate the functionality of the ASIC. In addition, the ASIC has been successfully used in a 3-D imaging experiment.
AB - This paper presents an ultrasound transceiver application-specific integrated circuit (ASIC) designed for 3-D ultrasonic imaging of the carotid artery. This application calls for an array of thousands of ultrasonic transducer elements, far exceeding the number of channels of conventional imaging systems. The 3.6 x 6.8 mm² ASIC interfaces a piezo-electric transducer (PZT) array of 24 x 40 elements, directly integrated on top of the ASIC, to an imaging system using only 24 transmit and receive channels. Multiple ASICs can be tiled together to form an even bigger array. The ASIC, implemented in a 0.18 μm high-voltage (HV) BCD process, consists of a reconfigurable switch matrix and row-level receive circuits. Each element is associated with a compact bootstrapped HV transmit switch, an isolation switch for the receive circuits and programmable logic that enables a variety of imaging modes. Electrical and acoustic experiments successfully demonstrate the functionality of the ASIC. In addition, the ASIC has been successfully used in a 3-D imaging experiment.
KW - 3-D ultrasound imaging
KW - high-voltage (HV) switches
KW - matrix transducer
KW - reconfigurability
KW - ultrasound application-specific integrated circuit (ASIC).
UR - http://www.scopus.com/inward/record.url?scp=85046004856&partnerID=8YFLogxK
U2 - 10.1109/JSSC.2018.2820156
DO - 10.1109/JSSC.2018.2820156
M3 - Article
AN - SCOPUS:85046004856
SN - 0018-9200
VL - 53
SP - 1
EP - 11
JO - IEEE Journal of Solid State Circuits
JF - IEEE Journal of Solid State Circuits
IS - 7
ER -