@inproceedings{91cc5fc0e6cb45b88494e1c763475014,
title = "A software tool for 3D meshing of VLSI interconnect structures",
keywords = "conference contrib. non-refer., Vakpubl., Overig wet. > 3 pag",
author = "{van der Kolk}, KJ and {van der Meijs}, NP",
note = "neo; ProRISC, 17th Annual Workshop on Circuits, Systems and Signal Processing, Veldhoven, The Netherlands ; Conference date: 23-11-2006 Through 24-11-2006",
year = "2006",
language = "Undefined/Unknown",
isbn = "90-73461-44-8",
publisher = "STW",
pages = "286--292",
editor = "STW",
booktitle = "Proceedings of the STW program ProRISC 23/11-24/11, Program for Research on Integrated Systems and Circuits",
}