@inproceedings{1e78466c5fd9405fbbaef05827a47496,
title = "A study on the creep damage of epoxy molding compound in IC package",
keywords = "Conf.proc. > 3 pag",
author = "S Liu and L Qin and D Yang and LJ Ernst and GQ Zhang",
year = "2003",
language = "Undefined/Unknown",
isbn = "0-7803-8168-8",
publisher = "IEEE Society",
pages = "254--259",
editor = "K Bi and PG Barnwell and J Wang",
booktitle = "ICEPT 2003",
note = "5th international conference on electronic packaging technology, Shanghai ; Conference date: 28-10-2003 Through 30-10-2003",
}