A sub-surface metallization post-process IC module for RF technology

TK Ng, PN Pham, B Rejaei Salmassi, PM Sarro, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	BCTM 2000 proceedings
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	195-198
Number of pages	4
ISBN (Print)	0-7803-6384-1
Publication status	Published - 2000
Event	Bipolar/BiCMOS Circuits and Technology Meeting 2000, Minneapolis - Piscataway Duration: 24 Sep 2000 → 26 Sep 2000

Name
Publisher	IEEE

Conference	Bipolar/BiCMOS Circuits and Technology Meeting 2000, Minneapolis
Period	24/09/00 → 26/09/00

Keywords

@inproceedings{74def24d75be45bf9657e2d858f88517,

title = "A sub-surface metallization post-process IC module for RF technology",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "TK Ng and PN Pham and {Rejaei Salmassi}, B and PM Sarro and JN Burghartz",

year = "2000",

language = "Undefined/Unknown",

isbn = "0-7803-6384-1",

publisher = "IEEE Society",

pages = "195--198",

booktitle = "BCTM 2000 proceedings",

note = "null ; Conference date: 24-09-2000 Through 26-09-2000",

}

TY - GEN

T1 - A sub-surface metallization post-process IC module for RF technology

AU - Ng, TK

AU - Pham, PN

AU - Rejaei Salmassi, B

AU - Sarro, PM

AU - Burghartz, JN

PY - 2000

Y1 - 2000

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-6384-1

SP - 195

EP - 198

BT - BCTM 2000 proceedings

PB - IEEE Society

CY - Piscataway

Y2 - 24 September 2000 through 26 September 2000

ER -