A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K                                                 2

Sining Pan; Kofi A.A. Makinwa

doi:10.1109/ISSCC.2019.8662337

A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K ²

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

31 Citations (Scopus)

80 Downloads (Pure)

Abstract

Temperature sensors intended for embedded applications should be both energy-and area-efficient. The combination of Wheatstone-bridge (WhB) sensors and continuous-time ADCs has proven to be highly energy efficient [1], [2]. However, their area (> 0.25 mm{2}) is still larger than that of comparable BJT-based sensors [3], [4]. This paper presents a temperature sensor that uses an FIR-DAC ADC to reduce its area and increase energy-efficiency, both by 2 × compared to the stateof-the-art [5].

Original language	English
Title of host publication	2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
Editors	Jan van der Spiegel
Place of Publication	Piscataway, NJ
Publisher	IEEE
Pages	186-188
Number of pages	3
Volume	2019-February
ISBN (Electronic)	978-1-5386-8531-0
ISBN (Print)	978-1-5386-8532-7
DOIs	https://doi.org/10.1109/ISSCC.2019.8662337
Publication status	Published - 2019
Event	ISSCC 2019: IEEE International Solid-State Circuits Conference - San Francisco, CA, United States Duration: 17 Feb 2019 → 21 Feb 2019

Conference

Conference	ISSCC 2019
Country/Territory	United States
City	San Francisco, CA
Period	17/02/19 → 21/02/19

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Session 10.4

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

Temperature sensors
Temperature measurement
Modulation
Switches
1/f noise
Ovens
Sensitivity

Access to Document

10.1109/ISSCC.2019.8662337

08662337Final published version, 299 KB

Cite this

@inproceedings{43d2142d2b114f49b6c1e4e47abab4e7,

title = "A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K 2",

abstract = "Temperature sensors intended for embedded applications should be both energy-and area-efficient. The combination of Wheatstone-bridge (WhB) sensors and continuous-time ADCs has proven to be highly energy efficient [1], [2]. However, their area (> 0.25 mm\{2\}) is still larger than that of comparable BJT-based sensors [3], [4]. This paper presents a temperature sensor that uses an FIR-DAC ADC to reduce its area and increase energy-efficiency, both by 2 × compared to the stateof-the-art [5].",

keywords = "Temperature sensors, Temperature measurement, Modulation, Switches, 1/f noise, Ovens, Sensitivity",

author = "Sining Pan and Makinwa, \{Kofi A.A.\}",

note = "Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Session 10.4; ISSCC 2019 : IEEE International Solid-State Circuits Conference ; Conference date: 17-02-2019 Through 21-02-2019",

year = "2019",

doi = "10.1109/ISSCC.2019.8662337",

language = "English",

isbn = "978-1-5386-8532-7 ",

volume = "2019-February",

pages = "186--188",

editor = "\{van der Spiegel\}, \{Jan \}",

booktitle = "2019 IEEE International Solid-State Circuits Conference, ISSCC 2019",

publisher = "IEEE",

address = "United States",

}

Pan, S & Makinwa, KAA 2019, A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K ². in J van der Spiegel (ed.), 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. vol. 2019-February, 8662337, IEEE, Piscataway, NJ, pp. 186-188, ISSCC 2019, San Francisco, CA, United States, 17/02/19. https://doi.org/10.1109/ISSCC.2019.8662337

A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K ². / Pan, Sining; Makinwa, Kofi A.A.
2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. ed. / Jan van der Spiegel. Vol. 2019-February Piscataway, NJ: IEEE, 2019. p. 186-188 8662337.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - A Wheatstone Bridge Temperature Sensor with a Resolution FoM of 20fJ.K 2

AU - Pan, Sining

AU - Makinwa, Kofi A.A.

N1 - Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Session 10.4

PY - 2019

Y1 - 2019

N2 - Temperature sensors intended for embedded applications should be both energy-and area-efficient. The combination of Wheatstone-bridge (WhB) sensors and continuous-time ADCs has proven to be highly energy efficient [1], [2]. However, their area (> 0.25 mm{2}) is still larger than that of comparable BJT-based sensors [3], [4]. This paper presents a temperature sensor that uses an FIR-DAC ADC to reduce its area and increase energy-efficiency, both by 2 × compared to the stateof-the-art [5].

AB - Temperature sensors intended for embedded applications should be both energy-and area-efficient. The combination of Wheatstone-bridge (WhB) sensors and continuous-time ADCs has proven to be highly energy efficient [1], [2]. However, their area (> 0.25 mm{2}) is still larger than that of comparable BJT-based sensors [3], [4]. This paper presents a temperature sensor that uses an FIR-DAC ADC to reduce its area and increase energy-efficiency, both by 2 × compared to the stateof-the-art [5].

KW - Temperature sensors

KW - Temperature measurement

KW - Modulation

KW - Switches

KW - 1/f noise

KW - Ovens

KW - Sensitivity

UR - https://www.scopus.com/pages/publications/85063522420

U2 - 10.1109/ISSCC.2019.8662337

DO - 10.1109/ISSCC.2019.8662337

M3 - Conference contribution

AN - SCOPUS:85063522420

SN - 978-1-5386-8532-7

VL - 2019-February

SP - 186

EP - 188

BT - 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019

A2 - van der Spiegel, Jan

PB - IEEE

CY - Piscataway, NJ

T2 - ISSCC 2019

Y2 - 17 February 2019 through 21 February 2019

ER -