Accurate small-scale manipulation

Bram Krijnen; Koen Swinkels; Dannis M. Brouwer; Leon Abelmann; Just Herder

Accurate small-scale manipulation

Bram Krijnen, Koen Swinkels, Dannis M. Brouwer, Leon Abelmann, Just Herder

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Abstract

A 3-DoF micro-electromechanical (MEMS) stage has been designed with an innovative integrated feedback system based on thermal sensors. The stage is integrated in the device layer of a silicon-oninsulator-wafer, which means that no assembly is required and the stage can be fabricated using only a single mask. The range of motion is over 160 μm in two directions and 325 mrad of rotation, which exceeds the range of motion of existing MEMS stages by far.

Original language	English
Pages (from-to)	16-19
Journal	Mikroniek: vakblad voor precisie-technologie
Volume	55
Issue number	5
Publication status	Published - 2015

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title = "Accurate small-scale manipulation",

abstract = "A 3-DoF micro-electromechanical (MEMS) stage has been designed with an innovative integrated feedback system based on thermal sensors. The stage is integrated in the device layer of a silicon-oninsulator-wafer, which means that no assembly is required and the stage can be fabricated using only a single mask. The range of motion is over 160 μm in two directions and 325 mrad of rotation, which exceeds the range of motion of existing MEMS stages by far.",

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AU - Krijnen, Bram

AU - Swinkels, Koen

AU - Brouwer, Dannis M.

AU - Abelmann, Leon

AU - Herder, Just

PY - 2015

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N2 - A 3-DoF micro-electromechanical (MEMS) stage has been designed with an innovative integrated feedback system based on thermal sensors. The stage is integrated in the device layer of a silicon-oninsulator-wafer, which means that no assembly is required and the stage can be fabricated using only a single mask. The range of motion is over 160 μm in two directions and 325 mrad of rotation, which exceeds the range of motion of existing MEMS stages by far.

AB - A 3-DoF micro-electromechanical (MEMS) stage has been designed with an innovative integrated feedback system based on thermal sensors. The stage is integrated in the device layer of a silicon-oninsulator-wafer, which means that no assembly is required and the stage can be fabricated using only a single mask. The range of motion is over 160 μm in two directions and 325 mrad of rotation, which exceeds the range of motion of existing MEMS stages by far.

M3 - Article

SN - 0026-3699

VL - 55

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EP - 19

JO - Mikroniek: vakblad voor precisie-technologie

JF - Mikroniek: vakblad voor precisie-technologie

IS - 5

ER -

Accurate small-scale manipulation

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