Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification

Shivani Joshi, Tonie van Loon, Angel Savov, Ronald Dekker

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)


Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.
Original languageEnglish
Pages (from-to)33-38
Number of pages6
JournalMRS Advances
Issue number1
Publication statusPublished - 2016


  • polymer
  • adhesion
  • sputtering


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