Abstract
Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.
Original language | English |
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Pages (from-to) | 33-38 |
Number of pages | 6 |
Journal | MRS Advances |
Volume | 1 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2016 |
Keywords
- polymer
- adhesion
- sputtering