Advanced LED package with temperature sensors and microfluidic cooling

H Ye, HW van Zeijl, R Sokolovskij, AWJ Gielen, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings 63rd Electronic Components and Technology Conference (ECTC 2013)
EditorsW Sauter
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1920-1925
Number of pages6
ISBN (Print)978-1-4799-0233-0
DOIs
Publication statusPublished - 2013
EventECTC 2013, Las Vegas, Nevada - Piscataway
Duration: 28 May 201331 May 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceECTC 2013, Las Vegas, Nevada
Period28/05/1331/05/13

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