Advanced LED package with temperature sensors and microfluidic cooling

H Ye; HW van Zeijl; R Sokolovskij; AWJ Gielen; GQ Zhang

doi:10.1109/ECTC.2013.6575840

Advanced LED package with temperature sensors and microfluidic cooling

H Ye, HW van Zeijl, R Sokolovskij, AWJ Gielen, GQ Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013)
Editors	W Sauter
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	1920-1925
Number of pages	6
ISBN (Print)	978-1-4799-0233-0
DOIs	https://doi.org/10.1109/ECTC.2013.6575840
Publication status	Published - 2013
Event	ECTC 2013, Las Vegas, Nevada - Piscataway Duration: 28 May 2013 → 31 May 2013

Publication series

Name
Publisher	IEEE

Conference

Conference	ECTC 2013, Las Vegas, Nevada
Period	28/05/13 → 31/05/13

Bibliographical note

Harvest

Access to Document

10.1109/ECTC.2013.6575840

Cite this

@inproceedings{f28cff65f3d24aa68ec3d0b9f8cad98a,

title = "Advanced LED package with temperature sensors and microfluidic cooling",

author = "H Ye and {van Zeijl}, HW and R Sokolovskij and AWJ Gielen and GQ Zhang",

note = "Harvest; ECTC 2013, Las Vegas, Nevada ; Conference date: 28-05-2013 Through 31-05-2013",

year = "2013",

doi = "10.1109/ECTC.2013.6575840",

language = "English",

isbn = "978-1-4799-0233-0",

publisher = "IEEE Society",

pages = "1920--1925",

editor = "W Sauter",

booktitle = "Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013)",

}

Advanced LED package with temperature sensors and microfluidic cooling. / Ye, H ; van Zeijl, HW; Sokolovskij, R et al.
Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). ed. / W Sauter. Piscataway, NJ, USA: IEEE Society, 2013. p. 1920-1925.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Advanced LED package with temperature sensors and microfluidic cooling

AU - Ye, H

AU - van Zeijl, HW

AU - Sokolovskij, R

AU - Gielen, AWJ

AU - Zhang, GQ

N1 - Harvest

PY - 2013

Y1 - 2013

U2 - 10.1109/ECTC.2013.6575840

DO - 10.1109/ECTC.2013.6575840

M3 - Conference contribution

SN - 978-1-4799-0233-0

SP - 1920

EP - 1925

BT - Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013)

A2 - Sauter, W

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - ECTC 2013, Las Vegas, Nevada

Y2 - 28 May 2013 through 31 May 2013

ER -