Advanced time-multiplexed plasma etching of high aspect ratio silicon structures

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	3106-3110
Number of pages	5
Journal	Journal of Vacuum Science and Technology. Part B: Microelectronics and Nanometer Structures
Volume	20
Issue number	6
Publication status	Published - 2002

Keywords

@article{98af4dd1d0c34391aeff551636f62d66,

title = "Advanced time-multiplexed plasma etching of high aspect ratio silicon structures",

keywords = "Elektrotechniek, Techniek, academic journal papers, ZX CWTS 1.00 <= JFIS < 3.00",

author = "MA Blauw and G Craciun and WG Sloof and PJ French and {van der Drift}, EWJM",

year = "2002",

language = "Undefined/Unknown",

volume = "20",

pages = "3106--3110",

journal = "Journal of Vacuum Science and Technology. Part B: Microelectronics and Nanometer Structures",

issn = "1071-1023",

publisher = "AVS Science and Technology Society",

number = "6",

}

TY - JOUR

T1 - Advanced time-multiplexed plasma etching of high aspect ratio silicon structures

AU - Blauw, MA

AU - Craciun, G

AU - Sloof, WG

AU - French, PJ

AU - van der Drift, EWJM

PY - 2002

Y1 - 2002

KW - Elektrotechniek

KW - Techniek

KW - academic journal papers

KW - ZX CWTS 1.00 <= JFIS < 3.00

M3 - Article

SN - 1071-1023

VL - 20

SP - 3106

EP - 3110

JO - Journal of Vacuum Science and Technology. Part B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology. Part B: Microelectronics and Nanometer Structures

IS - 6

ER -