Advancement in screen printed fire through silver paste metallisation of polysilicon based passivating contacts

Aditya Chaudhary*, Jan Hoß, Jan Lossen, René van Swaaij, Miro Zeman

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
20 Downloads (Pure)

Abstract

We have metallised n+ polysilicon passivated layer structures deposited by Low Pressure Chemical Vapor Deposition (LPCVD) with silver pastes. We analysed recombination at the metal contacts by photoluminescence imaging of metallised lifetime samples and found for the best paste, metal semiconductor recombination current density values (J0met) below 70 fA/cm2, with contact resistivity below 2 mΩcm2. To our knowledge, these are among the lowest values reported so far for full size M2 wafers with 150 nm thin polysilicon layer and wet chemical thin oxide. We also studied the effect of the peak firing temperature on the J0met and contact resistivity in this work. Further, we performed Scanning Electron Microscopy to further understand the silver polysilicon interface.

Original languageEnglish
Title of host publicationProceedings of the 9th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
EditorsLoic Tous, Guy Beaucarne, Jan Lossen, Gunnar Schubert
PublisherAmerican Institute of Physics
Number of pages7
ISBN (Electronic)978-0-7354-4101-9
DOIs
Publication statusPublished - 2021
Event9th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells, MIW 2020 - Genk, Virtual, Belgium
Duration: 5 Oct 20206 Oct 2020

Publication series

NameAIP Conference Proceedings
Volume2367
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference9th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells, MIW 2020
Country/TerritoryBelgium
CityGenk, Virtual
Period5/10/206/10/20

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