Advances in delamination modeling

O van der Sluis, CA Yuan, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Nanopackaging: Nanotechnologies and Electronics Packaging
Editors	JE Morris
Publisher	Springer
Pages	1-34
Number of pages	549
ISBN (Print)	978-0-387-47325-3
Publication status	Published - 2008

Keywords

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title = "Advances in delamination modeling",

keywords = "Boekdeel internat.wet",

author = "{van der Sluis}, O and CA Yuan and {van Driel}, WD and GQ Zhang",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-0-387-47325-3",

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editor = "JE Morris",

booktitle = "Nanopackaging: Nanotechnologies and Electronics Packaging",

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}

TY - CHAP

T1 - Advances in delamination modeling

AU - van der Sluis, O

AU - Yuan, CA

AU - van Driel, WD

AU - Zhang, GQ

PY - 2008

Y1 - 2008

KW - Boekdeel internat.wet

UR - http://www.springer.com/materials/nanotechnology/book/978-0-387-47325-3

M3 - Chapter

SN - 978-0-387-47325-3

SP - 1

EP - 34

BT - Nanopackaging: Nanotechnologies and Electronics Packaging

A2 - Morris, JE

PB - Springer

ER -