Air film based contactless planar positioning system with sub-micron precision

J Wesselingh, JW Spronck, RAJ van Ostayen, J van Eijk

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Abstract

This paper discusses a 6DoF positioning system that utilizes a thin air film to directly position flat substrates with sub-micrometer precision. Such a position system can be applied in the production of electronic devices, such as integrated circuits, flat panel displays and solar cells. All these devices are manufactured on a flat base substrate, e.g. a silicon wafer or glass plate. Precision positioning stages are used during exposure, inspection, alignment, etc. We present a planar positioning system where only the product mass is driven and without mechanical contact. This system has two main advantages: a moving mass of 2 to 3 orders of magnitude smaller, since the carrier stage is eliminated and the absence of mechanical contact reduces the chance of contamination or damage.
Original languageEnglish
Title of host publicationProceedings of the 11th International Conference of the European Society for Precision Engineering & Nano Technology, Euspen 2011, May 23-27, 2011, Lake Como, Italy
Editors n.a.
Place of PublicationLake Como, Italy
PublisherEUSPEN
Pages1-4
Number of pages4
ISBN (Print)9780955308291
Publication statusPublished - 2011
Event11th International Conference of the European Society for Precision Engineering & Nano Technology, Lake Como, Italy - Lake Como, Italy
Duration: 23 May 201127 May 2011

Publication series

Name
PublisherEuspen

Conference

Conference11th International Conference of the European Society for Precision Engineering & Nano Technology, Lake Como, Italy
Period23/05/1127/05/11

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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