TY - GEN
T1 - Air film based contactless planar positioning system with sub-micron precision
AU - Wesselingh, J
AU - Spronck, JW
AU - van Ostayen, RAJ
AU - van Eijk, J
PY - 2011
Y1 - 2011
N2 - This paper discusses a 6DoF positioning system that utilizes a thin air film to directly position flat substrates with sub-micrometer precision. Such a position system can be applied in the production of electronic devices, such as integrated circuits, flat panel displays and solar cells. All these devices are manufactured on a flat base substrate, e.g. a silicon wafer or glass plate. Precision positioning stages are used during exposure, inspection, alignment, etc. We present a planar positioning system where only the product mass is driven and without mechanical contact. This system has two main advantages: a moving mass of 2 to 3 orders of magnitude smaller, since the carrier stage is eliminated and the absence of mechanical contact reduces the chance of contamination or damage.
AB - This paper discusses a 6DoF positioning system that utilizes a thin air film to directly position flat substrates with sub-micrometer precision. Such a position system can be applied in the production of electronic devices, such as integrated circuits, flat panel displays and solar cells. All these devices are manufactured on a flat base substrate, e.g. a silicon wafer or glass plate. Precision positioning stages are used during exposure, inspection, alignment, etc. We present a planar positioning system where only the product mass is driven and without mechanical contact. This system has two main advantages: a moving mass of 2 to 3 orders of magnitude smaller, since the carrier stage is eliminated and the absence of mechanical contact reduces the chance of contamination or damage.
KW - conference contrib. refereed
KW - Conf.proc. > 3 pag
M3 - Conference contribution
SN - 9780955308291
SP - 1
EP - 4
BT - Proceedings of the 11th International Conference of the European Society for Precision Engineering & Nano Technology, Euspen 2011, May 23-27, 2011, Lake Como, Italy
A2 - n.a., null
PB - EUSPEN
CY - Lake Como, Italy
T2 - 11th International Conference of the European Society for Precision Engineering & Nano Technology, Lake Como, Italy
Y2 - 23 May 2011 through 27 May 2011
ER -