Alignment and Overlay Characterization for 3D Integration and Advanced Packaging

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProc. of 11th Electronic packaging and Technology conference 2009 (EPTC 2009)
Editors s.n.
Place of PublicationSingapore
PublisherIEEE Society
Pages1-5
Number of pages5
ISBN (Print)978-1-4244-5100-5
Publication statusPublished - 2009
Event11th Electronic packaging and Technology conference 2009 - Singapore
Duration: 9 Dec 200911 Dec 2009

Publication series

Name
PublisherIEEE

Conference

Conference11th Electronic packaging and Technology conference 2009
Period9/12/0911/12/09

Keywords

  • Conf.proc. > 3 pag

Cite this