An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

M Yazdan Mehr, A Bahrami, H Fischer, S Gielen, R Corbeij, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationProceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Editors s.n.
Place of PublicationPiscataway
PublisherIEEE Society
Pages1-4
Number of pages4
ISBN (Print)978-1-4799-9949-1
DOIs
Publication statusPublished - 2015
EventEuroSimE 2015: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Budapest, Hungary
Duration: 19 Apr 201522 Apr 2015
Conference number: 16
https://www.eurosime.org/index.php/2015-budapest/ (Conference program)
https://ieeexplore-ieee-org.tudelft.idm.oclc.org/servlet/opac?punumber=7095627 (Proceedings)

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2015
Abbreviated titleEuroSimE 2015
CountryHungary
CityBudapest
Period19/04/1522/04/15
Internet address

Cite this

Yazdan Mehr, M., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., van Driel, WD., & Zhang, GQ. (2015). An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components. In s.n. (Ed.), Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (pp. 1-4). IEEE Society. https://doi.org/10.1109/EuroSimE.2015.7103124