An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

M. Yazdan Mehr, A. Bahrami, H. Fischer, S. Gielen, R. Corbeij, W. D. Van Driel, G. Q. Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)

Abstract

In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning acoustic microscopy (SAM) is indeed one the best non-destructive tools for failure analysis purposes. It is also a useful technique for imaging the morphology, location and size distribution of defects in different microelectronics components. SAM can detect delaminations at sub-micron thicknesses. It is also one of the only available techniques capable of efficiently evaluating popcorning in PBGA's and is a also useful device to detect sub-micron air gaps. SAM can also be used to measure the thickness of an internal layer of material. Overall, SAM is an efficient tool for evaluating such a wide range of different defects in printed circuit boards, underfills, BGAs, wire bonds, discrete components, and wafers. In SAM a focused sound is directed from a transducer at a small point on a target object, as is schematically shown here. Sound, hitting a defect, inhomogeneity or a boundary inside material, is partly scatted and will be detected. The transducer transforms the reflected sound pulses into electromagnetic pulses which are displayed as pixels with defined gray values thereby creating an image. This article aims at giving an overview of scanning acoustic microscope (SAM) and explaining its operating principles and its limitations. A few examples are also given for further clarification.

Original languageEnglish
Title of host publication16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
ISBN (Electronic)9781479999507
DOIs
Publication statusPublished - 1 Jan 2015
EventEuroSimE 2015: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Budapest, Hungary
Duration: 19 Apr 201522 Apr 2015
Conference number: 16
https://www.eurosime.org/index.php/2015-budapest/ (Conference program)
https://ieeexplore-ieee-org.tudelft.idm.oclc.org/servlet/opac?punumber=7095627 (Proceedings)

Conference

ConferenceEuroSimE 2015
Abbreviated titleEuroSimE 2015
CountryHungary
CityBudapest
Period19/04/1522/04/15
Internet address

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    Mehr, M. Y., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., Van Driel, W. D., & Zhang, G. Q. (2015). An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components. In 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 [7103077] Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/EuroSimE.2015.7103077