An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

M Yazdan Mehr; A Bahrami; H Fischer; S Gielen; R Corbeij; WD van Driel; GQ Zhang

doi:10.1109/EuroSimE.2015.7103124

An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

M Yazdan Mehr, A Bahrami, H Fischer, S Gielen, R Corbeij, WD van Driel, GQ Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE
Pages	1-4
Number of pages	4
ISBN (Print)	978-1-4799-9949-1
DOIs	https://doi.org/10.1109/EuroSimE.2015.7103124
Publication status	Published - 2015
Event	EuroSimE 2015: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Budapest, Hungary Duration: 19 Apr 2015 → 22 Apr 2015 Conference number: 16 https://www.eurosime.org/index.php/2015-budapest/ (Conference program) https://ieeexplore-ieee-org.tudelft.idm.oclc.org/servlet/opac?punumber=7095627 (Proceedings)

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2015
Abbreviated title	EuroSimE 2015
Country/Territory	Hungary
City	Budapest
Period	19/04/15 → 22/04/15
Internet address	https://www.eurosime.org/index.php/2015-budapest/ (Conference program) https://ieeexplore-ieee-org.tudelft.idm.oclc.org/servlet/opac?punumber=7095627 (Proceedings)

Bibliographical note

harvest

Access to Document

10.1109/EuroSimE.2015.7103124

Cite this

Yazdan Mehr, M., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., van Driel, WD., & Zhang, GQ. (2015). An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components. In s.n. (Ed.), Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (pp. 1-4). IEEE. https://doi.org/10.1109/EuroSimE.2015.7103124

Yazdan Mehr, M ; Bahrami, A ; Fischer, H et al. / An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components. Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. editor / s.n. Piscataway : IEEE, 2015. pp. 1-4

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title = "An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components",

author = "{Yazdan Mehr}, M and A Bahrami and H Fischer and S Gielen and R Corbeij and {van Driel}, WD and GQ Zhang",

note = "harvest; EuroSimE 2015 : 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 ; Conference date: 19-04-2015 Through 22-04-2015",

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doi = "10.1109/EuroSimE.2015.7103124",

language = "English",

isbn = "978-1-4799-9949-1",

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booktitle = "Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

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Yazdan Mehr, M, Bahrami, A, Fischer, H, Gielen, S, Corbeij, R, van Driel, WD & Zhang, GQ 2015, An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components. in s.n. (ed.), Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. IEEE, Piscataway, pp. 1-4, EuroSimE 2015, Budapest, Hungary, 19/04/15. https://doi.org/10.1109/EuroSimE.2015.7103124

An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components. / Yazdan Mehr, M; Bahrami, A; Fischer, H et al.
Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. ed. / s.n. Piscataway: IEEE, 2015. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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T1 - An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

AU - Yazdan Mehr, M

AU - Bahrami, A

AU - Fischer, H

AU - Gielen, S

AU - Corbeij, R

AU - van Driel, WD

AU - Zhang, GQ

N1 - Conference code: 16

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DO - 10.1109/EuroSimE.2015.7103124

M3 - Conference contribution

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EP - 4

BT - Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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PB - IEEE

CY - Piscataway

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Y2 - 19 April 2015 through 22 April 2015

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Yazdan Mehr M, Bahrami A, Fischer H, Gielen S, Corbeij R, van Driel WD et al. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components. In s.n., editor, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway: IEEE. 2015. p. 1-4 doi: 10.1109/EuroSimE.2015.7103124