Analysis of Cu/low-k bond pad delamination by using a novel failure index

MAJ van Gils, O van der Sluis, GQ Zhang, JHJ Jansen, RMJ Voncken

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

11 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
EditorsLJ Ernst, GQ Zhang, P Rodgers, S Marco, O de Saint Leger
Place of PublicationPiscataway
PublisherIEEE Society
Pages190-196
Number of pages7
ISBN (Print)0-7803-9062-8
Publication statusPublished - 2005
Event6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany - Piscataway
Duration: 18 Apr 200520 Apr 2005

Publication series

Name
PublisherIEEE

Conference

Conference6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany
Period18/04/0520/04/05

Keywords

  • Conf.proc. > 3 pag

Cite this