Analysis of Cu/low-k bond pad delamination by using a novel failure index

MAJ van Gils; O van der Sluis; GQ Zhang; JHJ Jansen; RMJ Voncken

Analysis of Cu/low-k bond pad delamination by using a novel failure index

MAJ van Gils, O van der Sluis, GQ Zhang, JHJ Jansen, RMJ Voncken

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

15 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Editors	LJ Ernst, GQ Zhang, P Rodgers, S Marco, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE
Pages	190-196
Number of pages	7
ISBN (Print)	0-7803-9062-8
Publication status	Published - 2005
Event	6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany - Piscataway Duration: 18 Apr 2005 → 20 Apr 2005

Publication series

Name
Publisher	IEEE

Conference

Conference	6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany
Period	18/04/05 → 20/04/05

Keywords

Conf.proc. > 3 pag

Cite this

van Gils, MAJ., van der Sluis, O., Zhang, GQ., Jansen, JHJ., & Voncken, RMJ. (2005). Analysis of Cu/low-k bond pad delamination by using a novel failure index. In LJ. Ernst, GQ. Zhang, P. Rodgers, S. Marco, & O. de Saint Leger (Eds.), Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (pp. 190-196). IEEE.

van Gils, MAJ ; van der Sluis, O ; Zhang, GQ et al. / Analysis of Cu/low-k bond pad delamination by using a novel failure index. Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. editor / LJ Ernst ; GQ Zhang ; P Rodgers ; S Marco ; O de Saint Leger. Piscataway : IEEE, 2005. pp. 190-196

@inproceedings{47e74f79d846404a8cbfce68635658d1,

title = "Analysis of Cu/low-k bond pad delamination by using a novel failure index",

keywords = "Conf.proc. > 3 pag",

author = "{van Gils}, MAJ and {van der Sluis}, O and GQ Zhang and JHJ Jansen and RMJ Voncken",

year = "2005",

language = "Undefined/Unknown",

isbn = "0-7803-9062-8",

publisher = "IEEE",

pages = "190--196",

editor = "LJ Ernst and GQ Zhang and P Rodgers and S Marco and {de Saint Leger}, O",

booktitle = "Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems",

address = "United States",

note = "6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany ; Conference date: 18-04-2005 Through 20-04-2005",

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van Gils, MAJ, van der Sluis, O, Zhang, GQ, Jansen, JHJ & Voncken, RMJ 2005, Analysis of Cu/low-k bond pad delamination by using a novel failure index. in LJ Ernst, GQ Zhang, P Rodgers, S Marco & O de Saint Leger (eds), Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. IEEE, Piscataway, pp. 190-196, 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany, 18/04/05.

Analysis of Cu/low-k bond pad delamination by using a novel failure index. / van Gils, MAJ; van der Sluis, O; Zhang, GQ et al.
Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. ed. / LJ Ernst; GQ Zhang; P Rodgers; S Marco; O de Saint Leger. Piscataway: IEEE, 2005. p. 190-196.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Analysis of Cu/low-k bond pad delamination by using a novel failure index

AU - van Gils, MAJ

AU - van der Sluis, O

AU - Zhang, GQ

AU - Jansen, JHJ

AU - Voncken, RMJ

PY - 2005

Y1 - 2005

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9062-8

SP - 190

EP - 196

BT - Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Rodgers, P

A2 - Marco, S

A2 - de Saint Leger, O

PB - IEEE

CY - Piscataway

T2 - 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Berlin, Germany

Y2 - 18 April 2005 through 20 April 2005

ER -

van Gils MAJ, van der Sluis O, Zhang GQ, Jansen JHJ, Voncken RMJ. Analysis of Cu/low-k bond pad delamination by using a novel failure index. In Ernst LJ, Zhang GQ, Rodgers P, Marco S, de Saint Leger O, editors, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Piscataway: IEEE. 2005. p. 190-196