Analytical estimate for cure-induced stresses and warpage in flat packages

Engineering

• Induced Stress 100%
• Material Model 100%
• Cure Shrinkage 50%
• Models 50%
• Induced Residual Stress 50%
• Comparable Result 50%
• Computer Simulation 50%
• Assuming 50%
• Numerical Calculation 50%
• Stages 50%
• Free Strain 50%
• Chemical Shrinkage 50%
• Subsequent Cooling 50%

Material Science

• Shrinkage 100%
• Sheet Molding Compounds 50%
• Residual Stress 50%
• Viscoelastic Material 50%
• Temperature 25%
• Stress Analysis 25%
• Glass Transition Temperature 25%

INIS

• shrinkage 100%
• stress analysis 33%
• curing 33%
• transition temperature 33%
• contraction 33%