Analytical thermal modeling of flip-chip mounted semiconductor optical amplifiers

FM De Paola, V d' Alessandro, F Tamigi, N Rinaldi

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationProceedings, European Microelectronics and Packaging Symposium
Place of PublicationPrague
PublisherIMAPS CZ&SK
Pages207-212
Number of pages6
ISBN (Print)80-239-2835-X
Publication statusPublished - 2004
EventEuropean Microelectronics and Packaging Symposium, Prague, Czech Republic - Prague
Duration: 16 Jun 200418 Jun 2004

Publication series

Name
PublisherIMAPS CZ&SK

Conference

ConferenceEuropean Microelectronics and Packaging Symposium, Prague, Czech Republic
Period16/06/0418/06/04

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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