Anisotropic BN Nanosheet/polymer Composite Bulk Material: A Study on Mechanical Property

Jing Cheng, Xiao Liang Zeng, GuoQi Zhang, Qing Hua Hu, Huai Yu Ye, Pan Liu

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

With the miniaturization of electronic devices and the development of integrated circuit chips in higher density and higher frequencies, thermal management has become one of the most critical challenges in device performance and reliability. Thermal interface material is bonded between the chip and heat sink. In addition to its thermal conductivity, the mechanical property is essential. Good resilience can effectively fill the bonding gap and reduce thermal resistance, thus improve the overall thermal conductivity. In this paper, three methods are adopted to prepare BN nanosheets/polymer composites. Two polymer composites materials with BN nanosheets oriented were prepared through different suction filtration methods, and the process of homogenization and mixing prepared another sample. Then the microscopic appearance structure of the three materials was analyzed by scanning electron microscope(SEM). The anisotropic compression resilience and tensile properties were studied, respectively. The study showed that BN nanosheet-oriented materials have anisotropic mechanical properties. The better the orientation performance, the greater the difference in the anisotropic mechanical properties of the composite materials. Under the pressure of 0.08MPa, materials with better BN nanosheet orientation have excellent compression and resilience performance, but homogeneous composite materials have the best compression resilience performance. The tensile properties of the three composite materials are quite different. The tensile strength of the homogeneously composite materials can reach 119.59%, while the in-plane and through-plane tensile strength of the other two materials can reach 102.84%,38.52%, and 67.65%, 46.67%, respectively.
Original languageEnglish
Title of host publication2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
Subtitle of host publicationProceedings
PublisherIEEE
Number of pages4
ISBN (Electronic)978-1-6654-1391-6
ISBN (Print)978-1-6654-1392-3
DOIs
Publication statusPublished - 2021
EventICEPT 2021: 22nd International Conference on Electronic Packaging Technology - Xiamen, China
Duration: 14 Sep 202117 Sep 2021
Conference number: 22nd

Conference

ConferenceICEPT 2021
CountryChina
CityXiamen
Period14/09/2117/09/21

Keywords

  • Anisotropy
  • Mechanical properties
  • BN/polymer composite

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