Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Hengqian  Yi; E. Öztürk; Marco  Koelink; Jana  Krimmling; Andrei A.  Damian; Wojciech  Debski; H.W. van Zeijl; Guoqi Zhang; René H. Poelma

doi:10.1109/TCPMT.2022.3172618

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Hengqian Yi, E. Öztürk, Marco Koelink, Jana Krimmling, Andrei A. Damian, Wojciech Debski, H.W. van Zeijl, Guoqi Zhang, René H. Poelma^*

^*Corresponding author for this work

Electronic Components, Technology and Materials

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Abstract

High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package.

Original language	English
Article number	9795927
Pages (from-to)	893-901
Number of pages	9
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	12
Issue number	6
DOIs	https://doi.org/10.1109/TCPMT.2022.3172618
Publication status	Published - 2022

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS)
film-assisted molding
metalized polymer
monostatic frequency modulated continuous-wave (FMCW) radar
patch antennas
radar antenna-in-package (AiP)
SU-8
system-in-package (SiP)
through-polymer via (TPV)

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Antenna-in-Package_AiP_Using_Through-Polymer_Vias_TPVs_for_a_122-GHz_Radar_ChipFinal published version, 2.81 MB

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title = "Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip",

abstract = "High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package.",

keywords = "0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS), film-assisted molding, metalized polymer, monostatic frequency modulated continuous-wave (FMCW) radar, patch antennas, radar antenna-in-package (AiP), SU-8, system-in-package (SiP), through-polymer via (TPV)",

author = "Hengqian Yi and E. {\"O}zt{\"u}rk and Marco Koelink and Jana Krimmling and Damian, {Andrei A.} and Wojciech Debski and {van Zeijl}, H.W. and Guoqi Zhang and Poelma, {Ren{\'e} H.}",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.",

year = "2022",

doi = "10.1109/TCPMT.2022.3172618",

language = "English",

volume = "12",

pages = "893--901",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

number = "6",

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T1 - Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

AU - Yi, Hengqian

AU - Öztürk, E.

AU - Koelink, Marco

AU - Krimmling, Jana

AU - Damian, Andrei A.

AU - Debski, Wojciech

AU - van Zeijl, H.W.

AU - Zhang, Guoqi

AU - Poelma, René H.

N1 - Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

PY - 2022

Y1 - 2022

N2 - High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package.

AB - High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package.

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KW - patch antennas

KW - radar antenna-in-package (AiP)

KW - SU-8

KW - system-in-package (SiP)

KW - through-polymer via (TPV)

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M3 - Article

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

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M1 - 9795927

ER -

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Abstract

Bibliographical note

Keywords

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