Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Hengqian Yi, E. Öztürk, Marco Koelink, Jana Krimmling, Andrei A. Damian, Wojciech Debski, H.W. van Zeijl, Guoqi Zhang, René H. Poelma*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

Abstract

High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection is realized by through-polymer via (TPV) technology. The detailed fabrication process of the radar antenna-in-package (AiP) with TPV is discussed. The results from the functional tests of the radar AiP are presented and benchmarked to a commercial quad-flat no-leads (QFN) package with an open antenna cavity. The detection margin between the echo signal and the constant false alarm rate (CFAR) threshold is approximately 10 dB higher for the TPV radar AiP compared with the benchmarked commercial QFN package.
Original languageEnglish
Article number9795927
Pages (from-to)893-901
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume12
Issue number6
DOIs
Publication statusPublished - 2022

Keywords

  • 0.13-µm silicon germanium bipolar complementary metal-oxide semiconductor (SiGe BiCMOS)
  • film-assisted molding
  • metalized polymer
  • monostatic frequency modulated continuous-wave (FMCW) radar
  • patch antennas
  • radar antenna-in-package (AiP)
  • SU-8
  • system-in-package (SiP)
  • through-polymer via (TPV)

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