Application of PECVD a-SiC thin-film layer for encapsulation of microstructures

V Rajaraman, L Pakula, HTM Pham, PM Sarro, PJ French

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	The annual workshop on semiconductor advances for future electronics and sensors
Editors	s.n.
Place of Publication	Veldhoven, the Netherlands
Publisher	STW
Pages	609-612
Number of pages	4
ISBN (Print)	978-90-73461-56-7
Publication status	Published - 2008
Event	SAFE 2008, Veldhoven, the Netherlands - Veldhoven, the Nederlands Duration: 27 Nov 2008 → 28 Nov 2008

Name
Publisher	STW

Conference	SAFE 2008, Veldhoven, the Netherlands
Period	27/11/08 → 28/11/08

Keywords

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title = "Application of PECVD a-SiC thin-film layer for encapsulation of microstructures",

keywords = "conference contrib. non-refer., Vakpubl., Overig wet. > 3 pag",

author = "V Rajaraman and L Pakula and HTM Pham and PM Sarro and PJ French",

year = "2008",

language = "Undefined/Unknown",

isbn = "978-90-73461-56-7",

publisher = "STW",

pages = "609--612",

editor = "s.n.",

booktitle = "The annual workshop on semiconductor advances for future electronics and sensors",

note = "SAFE 2008, Veldhoven, the Netherlands ; Conference date: 27-11-2008 Through 28-11-2008",

}

Application of PECVD a-SiC thin-film layer for encapsulation of microstructures. / Rajaraman, V; Pakula, L; Pham, HTM et al.
The annual workshop on semiconductor advances for future electronics and sensors. ed. / s.n. Veldhoven, the Netherlands: STW, 2008. p. 609-612.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Application of PECVD a-SiC thin-film layer for encapsulation of microstructures

AU - Rajaraman, V

AU - Pakula, L

AU - Pham, HTM

AU - Sarro, PM

AU - French, PJ

PY - 2008

Y1 - 2008

KW - conference contrib. non-refer.

KW - Vakpubl., Overig wet. > 3 pag

M3 - Conference contribution

SN - 978-90-73461-56-7

SP - 609

EP - 612

BT - The annual workshop on semiconductor advances for future electronics and sensors

A2 - s.n., null

PB - STW

CY - Veldhoven, the Netherlands

T2 - SAFE 2008, Veldhoven, the Netherlands

Y2 - 27 November 2008 through 28 November 2008

ER -