Area-selective adhesive bonding using photosensitive bcb for wlcsp applications

A Poliakov, M Bartek, JN Burghartz

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    18 Citations (Scopus)


    This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5±3.9 J/m2 with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications. ©2005 ASME
    Original languageUndefined/Unknown
    Pages (from-to)7-11
    Number of pages5
    JournalJournal of Electronic Packaging
    Issue number1
    Publication statusPublished - 2005


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