Area-selective adhesive using photosensivite BCB for WLCSP applications

A Poliakov; M Bartek; JN Burghartz

Area-selective adhesive using photosensivite BCB for WLCSP applications

A Poliakov, M Bartek, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Polytronic 2003; Third international IEEE conference on polymers and adhesives in microelectronics and photonics
Editors	s.n.
Place of Publication	Grenoble
Publisher	TIMA laboratory
Pages	119-122
Number of pages	4
ISBN (Print)	2-84813-023-7
Publication status	Published - 2003
Event	Third international IEEE conference on polymers and adhesives in microelectronics and photonics, Montreux, Switserland - Grenoble Duration: 21 Oct 2003 → 23 Oct 2003

Publication series

Name
Publisher	TIMA laboratory

Conference

Conference	Third international IEEE conference on polymers and adhesives in microelectronics and photonics, Montreux, Switserland
Period	21/10/03 → 23/10/03

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{4252a2921e694caaadda09007ee557b2,

title = "Area-selective adhesive using photosensivite BCB for WLCSP applications",

keywords = "Conf.proc. > 3 pag",

author = "A Poliakov and M Bartek and JN Burghartz",

year = "2003",

language = "Undefined/Unknown",

isbn = "2-84813-023-7",

publisher = "TIMA laboratory",

pages = "119--122",

editor = "s.n.",

booktitle = "Polytronic 2003; Third international IEEE conference on polymers and adhesives in microelectronics and photonics",

note = "Third international IEEE conference on polymers and adhesives in microelectronics and photonics, Montreux, Switserland ; Conference date: 21-10-2003 Through 23-10-2003",

}

Poliakov, A, Bartek, M & Burghartz, JN 2003, Area-selective adhesive using photosensivite BCB for WLCSP applications. in s.n. (ed.), Polytronic 2003; Third international IEEE conference on polymers and adhesives in microelectronics and photonics. TIMA laboratory, Grenoble, pp. 119-122, Third international IEEE conference on polymers and adhesives in microelectronics and photonics, Montreux, Switserland, 21/10/03.

Area-selective adhesive using photosensivite BCB for WLCSP applications. / Poliakov, A; Bartek, M; Burghartz, JN.
Polytronic 2003; Third international IEEE conference on polymers and adhesives in microelectronics and photonics. ed. / s.n. Grenoble: TIMA laboratory, 2003. p. 119-122.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Area-selective adhesive using photosensivite BCB for WLCSP applications

AU - Poliakov, A

AU - Bartek, M

AU - Burghartz, JN

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 2-84813-023-7

SP - 119

EP - 122

BT - Polytronic 2003; Third international IEEE conference on polymers and adhesives in microelectronics and photonics

A2 - s.n., null

PB - TIMA laboratory

CY - Grenoble

T2 - Third international IEEE conference on polymers and adhesives in microelectronics and photonics, Montreux, Switserland

Y2 - 21 October 2003 through 23 October 2003

ER -