Assembly Induced Failures in Thin Film MEMS Packages

JJM Zaal; WD van Driel; JTM van Beek; GQ Zhang

Assembly Induced Failures in Thin Film MEMS Packages

JJM Zaal, WD van Driel, JTM van Beek, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing numer of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands
Editors	Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
Publisher	IEEE Society
Pages	227-231
Number of pages	5
ISBN (Print)	978-1-4244-4159-4
Publication status	Published - 2009

Publication series

Name
Publisher	IEEE

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Zaal, JJM., van Driel, WD., van Beek, JTM., & Zhang, GQ. (2009). Assembly Induced Failures in Thin Film MEMS Packages. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., & Saint Leger, O. de (Eds.), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands (pp. 227-231). IEEE Society.

Zaal, JJM ; van Driel, WD ; van Beek, JTM et al. / Assembly Induced Failures in Thin Film MEMS Packages. Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. editor / Ernst, L.J. ; Zhang, G.Q. ; Driel, W.D. van ; Rodgers, P. ; Bailey, C. ; Saint Leger, O. de. IEEE Society, 2009. pp. 227-231

@inproceedings{7d6412c88027446a808a81f7cf214af3,

title = "Assembly Induced Failures in Thin Film MEMS Packages",

abstract = "In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing numer of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "JJM Zaal and {van Driel}, WD and {van Beek}, JTM and GQ Zhang",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4159-4",

publisher = "IEEE Society",

pages = "227--231",

editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Driel, W.D. van} and {Rodgers, P.} and {Bailey, C.} and {Saint Leger, O. de}",

booktitle = "Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands",

}

Zaal, JJM, van Driel, WD, van Beek, JTM & Zhang, GQ 2009, Assembly Induced Failures in Thin Film MEMS Packages. in Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society, pp. 227-231.

Assembly Induced Failures in Thin Film MEMS Packages. / Zaal, JJM; van Driel, WD; van Beek, JTM et al.
Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. ed. / Ernst, L.J.; Zhang, G.Q.; Driel, W.D. van; Rodgers, P.; Bailey, C.; Saint Leger, O. de. IEEE Society, 2009. p. 227-231.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

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AU - van Beek, JTM

AU - Zhang, GQ

PY - 2009

Y1 - 2009

N2 - In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing numer of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.

AB - In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing numer of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4159-4

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EP - 231

BT - Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

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Zaal JJM, van Driel WD, van Beek JTM, Zhang GQ. Assembly Induced Failures in Thin Film MEMS Packages. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de, editors, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society. 2009. p. 227-231