Assembly Induced Failures in Thin Film MEMS Packages

JJM Zaal, WD van Driel, JTM van Beek, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

1 Citation (Scopus)


In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing numer of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands
Editors Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
PublisherIEEE Society
Number of pages5
ISBN (Print)978-1-4244-4159-4
Publication statusPublished - 2009

Publication series



  • conference contrib. refereed
  • Conf.proc. > 3 pag

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