In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing numer of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.
|Title of host publication||Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Eolectronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands|
|Editors|| Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de|
|Number of pages||5|
|Publication status||Published - 2009|
- conference contrib. refereed
- Conf.proc. > 3 pag