Balanced Stochastic Truncation of Coupled 3D Interconnect

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationIEEE International Conference on IC Design and Technology
EditorsA Scarpa, P Malcovati
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages13-16
Number of pages4
ISBN (Print)978-1-4673-4741-9
DOIs
Publication statusPublished - 2013
EventInternational Conference on IC Design and Technology - Piscataway, NJ, USA
Duration: 29 May 201331 May 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceInternational Conference on IC Design and Technology
Period29/05/1331/05/13

Cite this