Balanced Stochastic Truncation of Coupled 3D Interconnect

A Zjajo; NP van der Meijs; TGRM van Leuken

doi:10.1109/ICICDT.2013.6563292

Balanced Stochastic Truncation of Coupled 3D Interconnect

A Zjajo, NP van der Meijs, TGRM van Leuken

Signal Processing Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	IEEE International Conference on IC Design and Technology
Editors	A Scarpa, P Malcovati
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	13-16
Number of pages	4
ISBN (Print)	978-1-4673-4741-9
DOIs	https://doi.org/10.1109/ICICDT.2013.6563292
Publication status	Published - 2013
Event	International Conference on IC Design and Technology - Piscataway, NJ, USA Duration: 29 May 2013 → 31 May 2013

Publication series

Name
Publisher	IEEE

Conference

Conference	International Conference on IC Design and Technology
Period	29/05/13 → 31/05/13

Bibliographical note

INSPEC Accession Number:
13697402

Access to Document

10.1109/ICICDT.2013.6563292

Cite this

@inproceedings{2de7d35adc82436f94e17bd34a22dd70,

title = "Balanced Stochastic Truncation of Coupled 3D Interconnect",

author = "A Zjajo and {van der Meijs}, NP and {van Leuken}, TGRM",

note = "INSPEC Accession Number: 13697402; International Conference on IC Design and Technology ; Conference date: 29-05-2013 Through 31-05-2013",

year = "2013",

doi = "10.1109/ICICDT.2013.6563292",

language = "English",

isbn = "978-1-4673-4741-9",

publisher = "IEEE Society",

pages = "13--16",

editor = "A Scarpa and P Malcovati",

booktitle = "IEEE International Conference on IC Design and Technology",

}

Balanced Stochastic Truncation of Coupled 3D Interconnect. / Zjajo, A; van der Meijs, NP ; van Leuken, TGRM.

IEEE International Conference on IC Design and Technology. ed. / A Scarpa; P Malcovati. Piscataway, NJ, USA : IEEE Society, 2013. p. 13-16.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Balanced Stochastic Truncation of Coupled 3D Interconnect

AU - Zjajo, A

AU - van der Meijs, NP

AU - van Leuken, TGRM

N1 - INSPEC Accession Number: 13697402

PY - 2013

Y1 - 2013

U2 - 10.1109/ICICDT.2013.6563292

DO - 10.1109/ICICDT.2013.6563292

M3 - Conference contribution

SN - 978-1-4673-4741-9

SP - 13

EP - 16

BT - IEEE International Conference on IC Design and Technology

A2 - Scarpa, A

A2 - Malcovati, P

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - International Conference on IC Design and Technology

Y2 - 29 May 2013 through 31 May 2013

ER -