Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects

V Rajaraman, JJ Koning, E Ooms, G Pandraud, KAA Makinwa, H Boezen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems
EditorsL Buchaillot, H Zappe
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages220-223
Number of pages4
ISBN (Print)978-1--4673-0324-8
DOIs
Publication statusPublished - 2012
EventMEMS 2012, Paris, France - Piscataway, NJ, USA
Duration: 29 Jan 20122 Feb 2012

Publication series

Name
PublisherIEEE

Conference

ConferenceMEMS 2012, Paris, France
Period29/01/122/02/12

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