Bending and stretching studies on ultra-thin silicon substrates

L Wang, KMB Jansen, M Bartek, A Poliakov, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

6 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of the 6th international conference on electronics packaging technology
EditorsBi Keyun, Wang Chunqing
Place of PublicationPiscataway
PublisherIEEE Society
Pages682-686
Number of pages5
ISBN (Print)0-7803-9449-6
Publication statusPublished - 2005
Event6th international conference on electronics packaging technology, Shenzhen, China - Piscataway
Duration: 30 Aug 20052 Sep 2005

Publication series

Name
PublisherIEEE

Conference

Conference6th international conference on electronics packaging technology, Shenzhen, China
Period30/08/052/09/05

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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