Bending and stretching studies on ultra-thin silicon substrates

L Wang; KMB Jansen; M Bartek; A Poliakov; LJ Ernst

Bending and stretching studies on ultra-thin silicon substrates

L Wang, KMB Jansen, M Bartek, A Poliakov, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

7 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 6th international conference on electronics packaging technology
Editors	Bi Keyun, Wang Chunqing
Place of Publication	Piscataway
Publisher	IEEE
Pages	682-686
Number of pages	5
ISBN (Print)	0-7803-9449-6
Publication status	Published - 2005
Event	6th international conference on electronics packaging technology, Shenzhen, China - Piscataway Duration: 30 Aug 2005 → 2 Sept 2005

Publication series

Name
Publisher	IEEE

Conference

Conference	6th international conference on electronics packaging technology, Shenzhen, China
Period	30/08/05 → 2/09/05

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{5dfc60c1e03246ef9030bddb7ea9e381,

title = "Bending and stretching studies on ultra-thin silicon substrates",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "L Wang and KMB Jansen and M Bartek and A Poliakov and LJ Ernst",

year = "2005",

language = "Undefined/Unknown",

isbn = "0-7803-9449-6",

publisher = "IEEE",

pages = "682--686",

editor = "Bi Keyun and Wang Chunqing",

booktitle = "Proceedings of the 6th international conference on electronics packaging technology",

address = "United States",

note = "6th international conference on electronics packaging technology, Shenzhen, China ; Conference date: 30-08-2005 Through 02-09-2005",

}

Bending and stretching studies on ultra-thin silicon substrates. / Wang, L; Jansen, KMB; Bartek, M et al.
Proceedings of the 6th international conference on electronics packaging technology. ed. / Bi Keyun; Wang Chunqing. Piscataway: IEEE, 2005. p. 682-686.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Bending and stretching studies on ultra-thin silicon substrates

AU - Wang, L

AU - Jansen, KMB

AU - Bartek, M

AU - Poliakov, A

AU - Ernst, LJ

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9449-6

SP - 682

EP - 686

BT - Proceedings of the 6th international conference on electronics packaging technology

A2 - Keyun, Bi

A2 - Chunqing, Wang

PB - IEEE

CY - Piscataway

T2 - 6th international conference on electronics packaging technology, Shenzhen, China

Y2 - 30 August 2005 through 2 September 2005

ER -