Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

Guoping  Lv; Haidong Yan; Haidong Yan; Daoguo Yang; Xinke  Wu; Kuang  Sheng; Chaohui  Liu; Yakun  Zhang; Guoqi  Zhang

doi:10.1109/ICEPT56209.2022.9873375

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

Guoping Lv, Haidong Yan, Haidong Yan, Daoguo Yang, Xinke Wu, Kuang Sheng, Chaohui Liu, Yakun Zhang, Guoqi Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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Abstract

As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging modules due to their high thermal resistance and high-temperature reliability. To solve the above deficiency, a copper foam-silver composite was proposed in this paper, which was prepared by mixing copper foam solid skeleton with micron silver paste. According to the results of thermogravimetric analysis (TGA) of silver paste, the preheating process was determined and sintered at 270°C and 10MPa. The influence of different preparation technology on the quality of sintered joint was investigated. The morphology characteristics and distribution of sintered silver in the copper foam were observed by scanning electron microscope (SEM). The results show that the sintered silver of group C samples can be uniformly filled into the solid skeleton of copper foam, and the densification degree is high, without cracks, delamination, and holes. The shear strength can reach 55MPa.

Original language	English
Title of host publication	Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE
Pages	1-5
Number of pages	5
ISBN (Electronic)	978-1-6654-9905-7
ISBN (Print)	978-1-6654-9906-4
DOIs	https://doi.org/10.1109/ICEPT56209.2022.9873375
Publication status	Published - 2022
Event	2022 23rd International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China Duration: 10 Aug 2022 → 13 Aug 2022 Conference number: 23rd

Conference

Conference	2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Country/Territory	China
City	Dalian
Period	10/08/22 → 13/08/22

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

large-area bonding
copper foam-Ag composite film
preparation process

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10.1109/ICEPT56209.2022.9873375

Bonding_Process_of_Copper_Foam-Silver_Composite_and_Performance_Characterization_of_the_JointFinal published version, 1.21 MB

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title = "Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint",

abstract = "As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging modules due to their high thermal resistance and high-temperature reliability. To solve the above deficiency, a copper foam-silver composite was proposed in this paper, which was prepared by mixing copper foam solid skeleton with micron silver paste. According to the results of thermogravimetric analysis (TGA) of silver paste, the preheating process was determined and sintered at 270°C and 10MPa. The influence of different preparation technology on the quality of sintered joint was investigated. The morphology characteristics and distribution of sintered silver in the copper foam were observed by scanning electron microscope (SEM). The results show that the sintered silver of group C samples can be uniformly filled into the solid skeleton of copper foam, and the densification degree is high, without cracks, delamination, and holes. The shear strength can reach 55MPa.",

keywords = "large-area bonding, copper foam-Ag composite film, preparation process",

author = "Guoping Lv and Haidong Yan and Haidong Yan and Daoguo Yang and Xinke Wu and Kuang Sheng and Chaohui Liu and Yakun Zhang and Guoqi Zhang",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ; Conference date: 10-08-2022 Through 13-08-2022",

year = "2022",

doi = "10.1109/ICEPT56209.2022.9873375",

language = "English",

isbn = "978-1-6654-9906-4",

pages = "1--5",

booktitle = "Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE",

address = "United States",

}

Lv, G, Yan, H, Yan, H, Yang, D, Wu, X, Sheng, K, Liu, C, Zhang, Y & Zhang, G 2022, Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint. in Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1-5, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Dalian, China, 10/08/22. https://doi.org/10.1109/ICEPT56209.2022.9873375

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint. / Lv, Guoping ; Yan, Haidong; Yan, Haidong et al.
Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2022. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

AU - Lv, Guoping

AU - Yan, Haidong

AU - Yang, Daoguo

AU - Wu, Xinke

AU - Sheng, Kuang

AU - Liu, Chaohui

AU - Zhang, Yakun

AU - Zhang, Guoqi

N1 - Conference code: 23rd

PY - 2022

Y1 - 2022

N2 - As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging modules due to their high thermal resistance and high-temperature reliability. To solve the above deficiency, a copper foam-silver composite was proposed in this paper, which was prepared by mixing copper foam solid skeleton with micron silver paste. According to the results of thermogravimetric analysis (TGA) of silver paste, the preheating process was determined and sintered at 270°C and 10MPa. The influence of different preparation technology on the quality of sintered joint was investigated. The morphology characteristics and distribution of sintered silver in the copper foam were observed by scanning electron microscope (SEM). The results show that the sintered silver of group C samples can be uniformly filled into the solid skeleton of copper foam, and the densification degree is high, without cracks, delamination, and holes. The shear strength can reach 55MPa.

AB - As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging modules due to their high thermal resistance and high-temperature reliability. To solve the above deficiency, a copper foam-silver composite was proposed in this paper, which was prepared by mixing copper foam solid skeleton with micron silver paste. According to the results of thermogravimetric analysis (TGA) of silver paste, the preheating process was determined and sintered at 270°C and 10MPa. The influence of different preparation technology on the quality of sintered joint was investigated. The morphology characteristics and distribution of sintered silver in the copper foam were observed by scanning electron microscope (SEM). The results show that the sintered silver of group C samples can be uniformly filled into the solid skeleton of copper foam, and the densification degree is high, without cracks, delamination, and holes. The shear strength can reach 55MPa.

KW - large-area bonding

KW - copper foam-Ag composite film

KW - preparation process

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U2 - 10.1109/ICEPT56209.2022.9873375

DO - 10.1109/ICEPT56209.2022.9873375

M3 - Conference contribution

SN - 978-1-6654-9906-4

SP - 1

EP - 5

BT - Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

PB - IEEE

T2 - 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Y2 - 10 August 2022 through 13 August 2022

ER -

Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

Abstract

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Bibliographical note

Keywords

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