Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films

L La Spina, AW van Herwaarden, H Schellevis, WHA Wien, N Nenadovi¿, LK Nanver

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	675-683
Number of pages	9
Journal	IEEE Journal of Microelectromechanical Systems
Volume	6
Issue number	3
Publication status	Published - 2007

Keywords

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title = "Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films",

keywords = "academic journal papers, CWTS JFIS >= 2.00",

author = "{La Spina}, L and {van Herwaarden}, AW and H Schellevis and WHA Wien and N Nenadovi¿ and LK Nanver",

year = "2007",

language = "Undefined/Unknown",

volume = "6",

pages = "675--683",

journal = "IEEE Journal of Microelectromechanical Systems",

issn = "1057-7157",

publisher = "IEEE",

number = "3",

}

TY - JOUR

T1 - Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin Films

AU - La Spina, L

AU - van Herwaarden, AW

AU - Schellevis, H

AU - Wien, WHA

AU - Nenadovi¿, N

AU - Nanver, LK

PY - 2007

Y1 - 2007

KW - academic journal papers

KW - CWTS JFIS >= 2.00

M3 - Article

SN - 1057-7157

VL - 6

SP - 675

EP - 683

JO - IEEE Journal of Microelectromechanical Systems

JF - IEEE Journal of Microelectromechanical Systems

IS - 3

ER -