Cavity formation in a silicon cap wafer using aluminum etch-stop layer

S Sosin, J Tian, M Bartek

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageUndefined/Unknown
    Title of host publicationProc. 16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007)
    Editors n.s.
    Place of PublicationOulu
    PublisherIMAPS
    Pages304-308
    Number of pages5
    ISBN (Print)978-952-99751-1-2
    Publication statusPublished - 2007
    Event16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007) - Oulu
    Duration: 17 Jun 200720 Jun 2007

    Publication series

    Name
    PublisherIMAPS

    Conference

    Conference16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007)
    Period17/06/0720/06/07

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

    Cite this

    Sosin, S., Tian, J., & Bartek, M. (2007). Cavity formation in a silicon cap wafer using aluminum etch-stop layer. In n.s. (Ed.), Proc. 16th European Microelectronics and Packaging Conference & Exhibition (EMPC 2007) (pp. 304-308). IMAPS.