Challenges for MEMS Packaging Reliability

JJM Zaal, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Original languageEnglish
Title of host publicationSmart Systems Integration and Reliability. Honorary volume on the occasion of Herbert Reichl's 65th birthday
Editors Michel, Bernd, Lang, Klaus-Dieter
Place of PublicationDresden, Germany
PublisherGoldenbogen Verlag
ISBN (Print)978-3-932434-77-8
Publication statusPublished - 2010


  • edited books
  • Boekdeel internat.wet

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