Challenges for MEMS Packaging Reliability

JJM Zaal; WD van Driel; GQ Zhang

Challenges for MEMS Packaging Reliability

JJM Zaal, WD van Driel, GQ Zhang

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

Original language	English
Title of host publication	Smart Systems Integration and Reliability. Honorary volume on the occasion of Herbert Reichl's 65th birthday
Editors	Michel, Bernd, Lang, Klaus-Dieter
Place of Publication	Dresden, Germany
Publisher	Goldenbogen Verlag
Pages	246-254
ISBN (Print)	978-3-932434-77-8
Publication status	Published - 2010

Keywords

edited books
Boekdeel internat.wet

Cite this

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title = "Challenges for MEMS Packaging Reliability",

keywords = "edited books, Boekdeel internat.wet",

author = "JJM Zaal and {van Driel}, WD and GQ Zhang",

year = "2010",

language = "English",

isbn = "978-3-932434-77-8",

pages = "246--254",

editor = "{Michel, Bernd} and {Lang, Klaus-Dieter}",

booktitle = "Smart Systems Integration and Reliability. Honorary volume on the occasion of Herbert Reichl's 65th birthday",

publisher = "Goldenbogen Verlag",

}

Challenges for MEMS Packaging Reliability. / Zaal, JJM; van Driel, WD; Zhang, GQ.
Smart Systems Integration and Reliability. Honorary volume on the occasion of Herbert Reichl's 65th birthday. ed. / Michel, Bernd; Lang, Klaus-Dieter. Dresden, Germany: Goldenbogen Verlag, 2010. p. 246-254.

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

TY - CHAP

T1 - Challenges for MEMS Packaging Reliability

AU - Zaal, JJM

AU - van Driel, WD

AU - Zhang, GQ

PY - 2010

Y1 - 2010

KW - edited books

KW - Boekdeel internat.wet

M3 - Chapter

SN - 978-3-932434-77-8

SP - 246

EP - 254

BT - Smart Systems Integration and Reliability. Honorary volume on the occasion of Herbert Reichl's 65th birthday

A2 - Michel, Bernd, null

A2 - Lang, Klaus-Dieter, null

PB - Goldenbogen Verlag

CY - Dresden, Germany

ER -