Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application: And how to tackle them using computational techniques

Jens Bolten; Kerim T. Arat; Nezih Ünal; Caroline Porschatis; Thorsten Wahlbrink; Max C. Lemme

doi:10.1117/12.2279564

Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application: And how to tackle them using computational techniques

Jens Bolten
, Kerim T. Arat
, Nezih Ünal
, Caroline Porschatis
, Thorsten Wahlbrink
, Max C. Lemme

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

268 Downloads (Pure)

Abstract

In this paper key challenges posed on metrology by feature dimensions of 20nm and below are discussed. In detail, the need for software-based tools for SEM image acquisition and image analysis in environments where CD-SEMs are not available and/or not flexible enough to cover all inspection tasks is outlined. These environments include research at universities as well as industrial R and D environments focused on non-IC applications. The benefits of combining automated image acquisition and analysis with computational techniques to simulate image generation in a conventional analytical SEM with respect to the overall reliability, precision and speed of inspection will be demonstrated using real-life inspection tasks as demonstrators.

Original language	English
Title of host publication	33rd European Mask and Lithography Conference
Publisher	SPIE
Number of pages	7
Volume	10446
ISBN (Electronic)	9781510613560
DOIs	https://doi.org/10.1117/12.2279564
Publication status	Published - 2017
Event	33rd European Mask and Lithography Conference, EMLC 2017 - Dresden, Germany Duration: 26 Jun 2017 → 28 Jun 2017

Conference

Conference	33rd European Mask and Lithography Conference, EMLC 2017
Country/Territory	Germany
City	Dresden
Period	26/06/17 → 28/06/17

Keywords

Inspection
Metrology
Nanodevices
Nanofabrication
Scanning Electron Microscopy
SEM
Simulation

Access to Document

10.1117/12.2279564

104460GFinal published version, 824 KB

Cite this

Bolten, J., Arat, K. T., Ünal, N., Porschatis, C., Wahlbrink, T., & Lemme, M. C. (2017). Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application: And how to tackle them using computational techniques. In 33rd European Mask and Lithography Conference (Vol. 10446). Article 104460G SPIE. https://doi.org/10.1117/12.2279564

@inproceedings{fbec66fd2a3c407d92ab1d81cafbf7ad,

title = "Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application: And how to tackle them using computational techniques",

abstract = "In this paper key challenges posed on metrology by feature dimensions of 20nm and below are discussed. In detail, the need for software-based tools for SEM image acquisition and image analysis in environments where CD-SEMs are not available and/or not flexible enough to cover all inspection tasks is outlined. These environments include research at universities as well as industrial R and D environments focused on non-IC applications. The benefits of combining automated image acquisition and analysis with computational techniques to simulate image generation in a conventional analytical SEM with respect to the overall reliability, precision and speed of inspection will be demonstrated using real-life inspection tasks as demonstrators.",

keywords = "Inspection, Metrology, Nanodevices, Nanofabrication, Scanning Electron Microscopy, SEM, Simulation",

author = "Jens Bolten and Arat, \{Kerim T.\} and Nezih {\"U}nal and Caroline Porschatis and Thorsten Wahlbrink and Lemme, \{Max C.\}",

year = "2017",

doi = "10.1117/12.2279564",

language = "English",

volume = "10446",

booktitle = "33rd European Mask and Lithography Conference",

publisher = "SPIE",

address = "United States",

note = "33rd European Mask and Lithography Conference, EMLC 2017 ; Conference date: 26-06-2017 Through 28-06-2017",

}

Bolten, J, Arat, KT, Ünal, N, Porschatis, C, Wahlbrink, T & Lemme, MC 2017, Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application: And how to tackle them using computational techniques. in 33rd European Mask and Lithography Conference. vol. 10446, 104460G, SPIE, 33rd European Mask and Lithography Conference, EMLC 2017, Dresden, Germany, 26/06/17. https://doi.org/10.1117/12.2279564

Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application: And how to tackle them using computational techniques. / Bolten, Jens; Arat, Kerim T.; Ünal, Nezih et al.
33rd European Mask and Lithography Conference. Vol. 10446 SPIE, 2017. 104460G.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application

T2 - 33rd European Mask and Lithography Conference, EMLC 2017

AU - Bolten, Jens

AU - Arat, Kerim T.

AU - Ünal, Nezih

AU - Porschatis, Caroline

AU - Wahlbrink, Thorsten

AU - Lemme, Max C.

PY - 2017

Y1 - 2017

N2 - In this paper key challenges posed on metrology by feature dimensions of 20nm and below are discussed. In detail, the need for software-based tools for SEM image acquisition and image analysis in environments where CD-SEMs are not available and/or not flexible enough to cover all inspection tasks is outlined. These environments include research at universities as well as industrial R and D environments focused on non-IC applications. The benefits of combining automated image acquisition and analysis with computational techniques to simulate image generation in a conventional analytical SEM with respect to the overall reliability, precision and speed of inspection will be demonstrated using real-life inspection tasks as demonstrators.

AB - In this paper key challenges posed on metrology by feature dimensions of 20nm and below are discussed. In detail, the need for software-based tools for SEM image acquisition and image analysis in environments where CD-SEMs are not available and/or not flexible enough to cover all inspection tasks is outlined. These environments include research at universities as well as industrial R and D environments focused on non-IC applications. The benefits of combining automated image acquisition and analysis with computational techniques to simulate image generation in a conventional analytical SEM with respect to the overall reliability, precision and speed of inspection will be demonstrated using real-life inspection tasks as demonstrators.

KW - Inspection

KW - Metrology

KW - Nanodevices

KW - Nanofabrication

KW - Scanning Electron Microscopy

KW - SEM

KW - Simulation

UR - https://www.scopus.com/pages/publications/85031702447

UR - http://discover.tudelft.nl/uuid:fbec66fd-2a3c-407d-92ab-1d81cafbf7ad

U2 - 10.1117/12.2279564

DO - 10.1117/12.2279564

M3 - Conference contribution

AN - SCOPUS:85031702447

VL - 10446

BT - 33rd European Mask and Lithography Conference

PB - SPIE

Y2 - 26 June 2017 through 28 June 2017

ER -

Challenges for scanning electron microscopy and inspection on the nanometer scale for non-IC application: And how to tackle them using computational techniques

Abstract

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this