Challenges in the assembly and handling of thin film capped MEMS devices

JJM Zaal; WD van Driel; GQ Zhang

Challenges in the assembly and handling of thin film capped MEMS devices

JJM Zaal, WD van Driel, GQ Zhang

Computational Design and Mechanics

Research output: Contribution to journal › Article › Scientific › peer-review

8 Citations (Scopus)

Abstract

This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly. Keywords: MEMS; wafer level thin film package; packaging; resonator

Original language	English
Pages (from-to)	3989-4001
Number of pages	13
Journal	Sensors
Volume	10
Publication status	Published - 2010

Keywords

academic journal papers
CWTS JFIS < 0.75

Cite this

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title = "Challenges in the assembly and handling of thin film capped MEMS devices",

abstract = "This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly. Keywords: MEMS; wafer level thin film package; packaging; resonator",

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AU - van Driel, WD

AU - Zhang, GQ

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N2 - This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly. Keywords: MEMS; wafer level thin film package; packaging; resonator

AB - This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly. Keywords: MEMS; wafer level thin film package; packaging; resonator

KW - academic journal papers

KW - CWTS JFIS < 0.75

M3 - Article

SN - 1424-8220

VL - 10

SP - 3989

EP - 4001

JO - Sensors

JF - Sensors

ER -

Challenges in the assembly and handling of thin film capped MEMS devices

Abstract

Keywords

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