Challenges of viscoelastic characterization of low Tg epoxy based adhesives for automotive applications in DMA and relaxation experiments

I Maus, H Preu, M Niessner, M Fink, KMB Jansen, R Pantou, B Michel, B Wunderle

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    3 Citations (Scopus)
    Original languageEnglish
    Title of host publicationProceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems
    EditorsB Vandevelde
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages1-7
    Number of pages7
    ISBN (Print)978-1-4799-4791-1
    DOIs
    Publication statusPublished - 2014
    EventEuroSimE 2014: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Ghent, Belgium
    Duration: 7 Apr 20149 Apr 2014

    Conference

    ConferenceEuroSimE 2014
    CountryBelgium
    CityGhent
    Period7/04/149/04/14

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