Chapter 5 Void formation by Kirkendall effect in solder joints

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

Original language	English
Title of host publication	The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Editors	G Grossmann, C Zardini
Place of Publication	London
Publisher	Springer
Pages	105-122
Number of pages	313
ISBN (Print)	978-0-85729-235-3
Publication status	Published - 2011

Keywords

@inbook{a773911057384e288c090eb04bc85635,

title = "Chapter 5 Void formation by Kirkendall effect in solder joints",

keywords = "edited books, Boekdeel internat.wet",

author = "MJM Hermans and MH Biglari",

year = "2011",

language = "English",

isbn = "978-0-85729-235-3",

pages = "105--122",

editor = "G Grossmann and C Zardini",

booktitle = "The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects",

publisher = "Springer",

}

TY - CHAP

T1 - Chapter 5 Void formation by Kirkendall effect in solder joints

AU - Hermans, MJM

AU - Biglari, MH

PY - 2011

Y1 - 2011

KW - edited books

KW - Boekdeel internat.wet

UR - http://www.springerlink.com/content/hn1712861n804w05/fulltext.pdf

M3 - Chapter

SN - 978-0-85729-235-3

SP - 105

EP - 122

BT - The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

A2 - Grossmann, G

A2 - Zardini, C

PB - Springer

CY - London

ER -