Chapter 5 Void formation by Kirkendall effect in solder joints

MJM Hermans, MH Biglari

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

    Original languageEnglish
    Title of host publicationThe ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
    EditorsG Grossmann, C Zardini
    Place of PublicationLondon
    Number of pages313
    ISBN (Print)978-0-85729-235-3
    Publication statusPublished - 2011


    • edited books
    • Boekdeel internat.wet

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