During the encapsulation of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die. These residual stresses add up to the stresses generated during thermal cycling and mechanical loading and may eventually lead to product failure. In this paper we focus on three commercial molding compounds and analyze in detail the increase in elastic modulus and the change in viscoelastic behaviour during cure. This was done with a special shear tool which allows to measure mechanical properties with sufficient accuracy in the liquid as well as in the solid state. The cure dependent viscoelastic material behaviour was modeled using a cure dependent shift factor and rubber modulus.
The visoelastic behaviour of the molding compounds is also shown not to be stable. During postcure the materials slowly continue to crosslink thereby systematically changing their viscoelastic behaviour. The material models presented here therefore only account for the initial curing stage and do not include postcure.
|Title of host publication||Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems|
|Editors|| Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Saint Leger, O. de|
|Place of Publication||Freiburg-im-Breisgau|
|Number of pages||4|
|Publication status||Published - 2008|
|Event||9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - Freiburg-im-Breisgau|
Duration: 21 Apr 2008 → 23 Apr 2008
|Conference||9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems|
|Period||21/04/08 → 23/04/08|
- conference contrib. refereed
- Conf.proc. > 3 pag