Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

I Maus; H Preu; M Niessner; H Nabi; KMB Jansen; R Pantou; L Weiss; B Michel; B Wunderle

doi:10.1109/ESTC.2014.6962781

Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

I Maus, H Preu, M Niessner, H Nabi, KMB Jansen, R Pantou, L Weiss, B Michel, B Wunderle

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the ESTC Electronic sytem-integration technology conference 2014
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE
Pages	1-7
Number of pages	7
ISBN (Print)	978-1-4799-4026-4
DOIs	https://doi.org/10.1109/ESTC.2014.6962781
Publication status	Published - 2014
Event	ESTC 2014: 5th Electronic Sytem-Integration Technology Conference - Helsinki, Finland Duration: 16 Sept 2014 → 18 Sept 2014 Conference number: 5

Publication series

Name
Publisher	IEEE

Conference

Conference	ESTC 2014
Country/Territory	Finland
City	Helsinki
Period	16/09/14 → 18/09/14

Access to Document

10.1109/ESTC.2014.6962781

Cite this

Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B., & Wunderle, B. (2014). Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution. In s.n. (Ed.), Proceedings of the ESTC Electronic sytem-integration technology conference 2014 (pp. 1-7). IEEE. https://doi.org/10.1109/ESTC.2014.6962781

@inproceedings{3c2cf108e5414fcbb4b04cf9dd00f5f0,

title = "Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution",

author = "I Maus and H Preu and M Niessner and H Nabi and KMB Jansen and R Pantou and L Weiss and B Michel and B Wunderle",

year = "2014",

doi = "10.1109/ESTC.2014.6962781",

language = "English",

isbn = "978-1-4799-4026-4",

publisher = "IEEE",

pages = "1--7",

editor = "s.n.",

booktitle = "Proceedings of the ESTC Electronic sytem-integration technology conference 2014",

address = "United States",

note = "ESTC 2014 : 5th Electronic Sytem-Integration Technology Conference ; Conference date: 16-09-2014 Through 18-09-2014",

}

Maus, I, Preu, H, Niessner, M, Nabi, H, Jansen, KMB, Pantou, R, Weiss, L, Michel, B & Wunderle, B 2014, Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution. in s.n. (ed.), Proceedings of the ESTC Electronic sytem-integration technology conference 2014. IEEE, Piscataway, pp. 1-7, ESTC 2014, Helsinki, Finland, 16/09/14. https://doi.org/10.1109/ESTC.2014.6962781

Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution. / Maus, I; Preu, H; Niessner, M et al.
Proceedings of the ESTC Electronic sytem-integration technology conference 2014. ed. / s.n. Piscataway: IEEE, 2014. p. 1-7.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

AU - Maus, I

AU - Preu, H

AU - Niessner, M

AU - Nabi, H

AU - Jansen, KMB

AU - Pantou, R

AU - Weiss, L

AU - Michel, B

AU - Wunderle, B

N1 - Conference code: 5

PY - 2014

Y1 - 2014

U2 - 10.1109/ESTC.2014.6962781

DO - 10.1109/ESTC.2014.6962781

M3 - Conference contribution

SN - 978-1-4799-4026-4

SP - 1

EP - 7

BT - Proceedings of the ESTC Electronic sytem-integration technology conference 2014

A2 - s.n., null

PB - IEEE

CY - Piscataway

T2 - ESTC 2014

Y2 - 16 September 2014 through 18 September 2014

ER -

Maus I, Preu H, Niessner M, Nabi H, Jansen KMB, Pantou R et al. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution. In s.n., editor, Proceedings of the ESTC Electronic sytem-integration technology conference 2014. Piscataway: IEEE. 2014. p. 1-7 doi: 10.1109/ESTC.2014.6962781