Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution

I Maus, H Preu, M Niessner, H Nabi, KMB Jansen, R Pantou, L Weiss, B Michel, B Wunderle

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationProceedings of the ESTC Electronic sytem-integration technology conference 2014
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages1-7
    Number of pages7
    ISBN (Print)978-1-4799-4026-4
    DOIs
    Publication statusPublished - 2014
    EventESTC 2014: 5th Electronic Sytem-Integration Technology Conference - Helsinki, Finland
    Duration: 16 Sep 201418 Sep 2014
    Conference number: 5

    Publication series

    Name
    PublisherIEEE

    Conference

    ConferenceESTC 2014
    CountryFinland
    CityHelsinki
    Period16/09/1418/09/14

    Cite this

    Maus, I., Preu, H., Niessner, M., Nabi, H., Jansen, KMB., Pantou, R., Weiss, L., Michel, B., & Wunderle, B. (2014). Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization- difficulties and solution. In s.n. (Ed.), Proceedings of the ESTC Electronic sytem-integration technology conference 2014 (pp. 1-7). IEEE Society. https://doi.org/10.1109/ESTC.2014.6962781