Characterization of epoxy based highly filled die attach materials in microelectronics

I. Maus, C. Liebl, M. Fink, Duc-Khoi Vu, M. Hartung, H. Preu, Kaspar Jansen, B. Michel, B Wunderle, Laurens Weiss

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Abstract

In semiconductor technologies thermally and electrically conductive adhesives are widely used to attach the die to the substrate. Focus of this work are Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles and the characterization of such materials.

Original languageEnglish
Title of host publication2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
PublisherIEEE
Pages1-7
Number of pages7
ISBN (Electronic)978-1-5090-4344-6
ISBN (Print)978-1-5090-4345-3
DOIs
Publication statusPublished - 2017
Event18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dresden, Germany
Duration: 3 Apr 20175 Apr 2017

Conference

Conference18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017
CountryGermany
CityDresden
Period3/04/175/04/17

Keywords

  • Temperature measurement
  • Microassembly
  • Curing
  • Material properties
  • Temperature distribution
  • Heating Systems

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